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Manufacturing method of low-dielectric-constant bismaleimide resin

A maleimide resin, bismaleimide technology, applied in the field of manufacturing, can solve the problems of high cost of raw materials, cumbersome preparation process of fluorine-containing modifier, limited application and the like

Inactive Publication Date: 2014-06-25
SHANGHAI INST OF ORGANIC CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation process of the fluorine-containing modifier used in these attempts is cumbersome and the cost of raw materials is high, which limits its application.

Method used

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  • Manufacturing method of low-dielectric-constant bismaleimide resin
  • Manufacturing method of low-dielectric-constant bismaleimide resin
  • Manufacturing method of low-dielectric-constant bismaleimide resin

Examples

Experimental program
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preparation example Construction

[0105] The preparation process of the resin is not particularly limited, and it can usually be obtained by copolymerization according to the conditions of the present invention. In particular, in a preferred embodiment of the present invention, the preparation of the resin comprises the following steps:

[0106] (1) In a solvent-free state, or in a polar solvent, react a compound of formula I with a compound of formula II to obtain a compound of formula IIa; preferably, the reaction is an ene reaction;

[0107]

[0108] (2) In a solvent-free state, or in a polar solvent, react a compound of formula IIa with a compound of formula I to obtain a compound of formula IIb; preferably, the reaction is a Diels-Alder reaction;

[0109]

[0110] (3) in solvent-free state, or in polar solvent, react with formula IIb compound and formula I compound, obtain the low dielectric constant bismaleimide resin shown in formula III:

[0111]

[0112] In the formula, the definition of eac...

Embodiment 1

[0147] The synthesis of embodiment 1 cinnamene pentafluorobenzene

[0148]

[0149] Under cooling in a dry-ice acetone bath (-78oC), add 100 ml of tetrahydrofuran and 5.8 g of N,N,N,N-tetramethylethylenediamine (TMEDA) into a 1000 ml two-necked flask that has been ventilated three times. 0.05mol). After stirring well, 20 ml of n-butyllithium (0.05 mol) was added dropwise to the mixture. After stirring for 30 minutes, 8.4 g (0.05 mol) of pentafluorobenzene was slowly added dropwise to the mixture. After dripping, the mixture was stirred for 30 minutes, and a solution of 14.8 grams of cinnamyl bromide (0.075mol) in tetrahydrofuran (100 ml) was added dropwise to the mixture. After dripping, it was stirred at -78°C for 1 hour, and then the cooling bath was removed. , the reaction system naturally rose to room temperature, and stirred at room temperature for 15 hours. The reaction solution was quenched with 200 milliliters of water, then extracted the reaction solution with 2...

Embodiment 2

[0150] Preparation of embodiment 2 modified bismaleimide curing resin and its dielectric constant test

[0151] Grind 3.2 g (9 mmol) of diphenylmethane bismaleimide and cinnamyl pentafluorobenzene (0.28 g, 1 mmol) obtained in Example 1 into fine powder, mix them uniformly, add them to the reaction tube, and pump and ventilate 3 times. The temperature was raised from room temperature to 180° C. at a rate of 50° C. per hour and kept for 10 hours to obtain a transparent dark yellow modified bismaleimide cured resin.

[0152] The dielectric constant of the cured resin was tested by the capacitance method. The results showed that the dielectric constant of the resin ranged from 2.90 to 2.75 in the range of 10 kHz to 30 MHz, and the corresponding dielectric loss tangent was 5.8 per thousand.

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Abstract

The invention provides a preparation method of low-dielectric-constant bismaleimide resin. The method particularly comprises the step of carrying out copolymerization on bismaleimide monomers and allyl-containing fluoro-arene, so as to obtain the modified bismaleimide resin. The prepared resin presents a low dielectric constant, has a low curing temperature and can be taken as a high-temperature-resistant adhesive as well as an encapsulating material and laminated matrix resin of electron components in electronic and electrical industries.

Description

technical field [0001] The invention belongs to the field of manufacturing high-performance polymer materials, and in particular relates to a method for manufacturing low dielectric constant bismaleimide resin. Background technique [0002] Because bismaleimide can self-polymerize when heated, it does not emit small molecule volatiles. The polymerized product has a high heat-resistant temperature and good electrical insulation performance. It is the most cost-effective thermosetting resin. Tall variety. However, the material formed by the self-polymerization of pure bismaleimide is relatively brittle, so it must be toughened and modified. The modified resins that have been commercialized are mainly diallyl bisphenol A modified bismaleimide resin and binary aromatic amine modified bismaleimide resin. That is to extend the chain of pure resin, thereby reducing the cross-linking density of the resin. Compared with the pure resin, the toughness of the modified resin after cha...

Claims

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Application Information

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IPC IPC(8): C08G61/12C08L65/00C08J5/24C08J5/04
Inventor 房强童佳伟金凯凯王佳佳袁超
Owner SHANGHAI INST OF ORGANIC CHEMISTRY - CHINESE ACAD OF SCI