Leading wire framework processing method

A technology of a lead frame and a processing method, applied in the field of circuit board processing and manufacturing, can solve problems such as difficulty in meeting requirements and limited manufacturing accuracy, and achieve the effect of controlling processing accuracy

Active Publication Date: 2014-06-25
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Traditional stamping and etching processes are limited in manufacturing accuracy, and it is difficult to meet the needs in some scenarios with higher requirements

Method used

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Embodiment Construction

[0034] An embodiment of the present invention provides a lead frame processing method in order to further improve the manufacturing accuracy of the lead frame.

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0036] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the data so used are interchange...

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Abstract

The invention discloses a leading wire framework processing method. The leading wire framework processing method comprises steps that: a first face of a carrier material is processed to form a first conductive layer; the first conductive layer is provided with a medium layer; multiple holes are formed on the medium layer through drilling and penetrate through the first conductive layer; a first film is pasted on the medium layer on which the multiple holes are formed through drilling; exposure development processing on the first film is carried out to expose the holes; a conductive substance is filled in the holes; the carrier material is removed; the first conductive layer is processed to form a line graph. The leading wire framework processing method facilitates to improve manufacturing precision of a leading wire framework.

Description

technical field [0001] The invention relates to the technical field of circuit board processing and manufacturing, in particular to a method for processing a lead frame. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the internal circuit of the chip and the external lead by means of a bonding material (gold wire, aluminum wire or copper wire) to form an electrical circuit. Among them, the lead frame plays the role of a bridge connecting with the external wires. At present, most of the semiconductor integrated chips need to use the lead frame. The lead frame is an important basic device in the electronic information industry. [0003] At present, the traditional lead frame production process is divided into two categories: punching type and etching type, and punching type production is currently the mainstream. For example, there are hundr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
CPCH01L21/4821
Inventor 陈冲刘德波孔令文彭勤卫杨志刚
Owner SHENNAN CIRCUITS
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