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On-line hot-dipping method of metal wires and adopted swinging device

A metal wire, swing device technology, applied in hot dip plating process, metal material coating process, coating and other directions, can solve the problems of reducing the appearance of tinned wire, anti-oxidation performance, solderability, etc., to improve the appearance, operation Stable and reliable, simple structure effect

Inactive Publication Date: 2014-07-02
谢国锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the surface of the molten tin in the tin bath is easily oxidized to form a tin oxide film, when the metal wire leaves the tin bath, it has to pass through the tin oxide film, so that the surface inevitably carries the tin oxide film, Thereby reducing the appearance, oxidation resistance, solderability and other effects of the tinned wire

Method used

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  • On-line hot-dipping method of metal wires and adopted swinging device

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Embodiment Construction

[0016] Below in conjunction with accompanying drawing, take the tin-plated wire as example to describe the specific embodiment of the present invention in detail:

[0017] Such as figure 1 As shown, an on-line hot-dip plating method for metal wires, the steps are: first immerse the metal wires in the flux for more than 2 seconds during the advancing process, and then immerse them in a place where the temperature is controlled between 230 and 270°C. In the hot-dip plating solution for more than 5 seconds, usually 8 to 10 seconds, then let the metal wire coated with the plating solution pass through the die hole of the sizing die, and then, from the hot-dip plating solution in a horizontal swing The method passes through the liquid surface, so that no oxide film is formed at the place where the metal wire passes through, and the wire is cooled faster; the speed of the lateral swing of the wire is between 2 and 10 cm / s, usually 3 cm / s seconds; the swing range is between 0.5 and ...

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Abstract

The invention discloses an on-line hot-dipping method of metal wires, which is used for preventing the metal wires from carrying metal wires or enabling the metal wires to carry oxide films as few as possible while getting out after dip-plating. The on-line hot-dipping method comprises the steps of soaking for over two seconds in soldering flux in a wire advancing process; then, soaking in hot-dipping liquid with a temperature controlled between 230 DEG C and 270 DEG C for over five seconds; and penetrating wires plated with the dipping liquid through mould holes of a sizing mould, and then penetrating out from the hot-dipping liquid in a transverse swinging way, so that the oxide film is not formed at a wire getting-out part, and the wire is cooled quicker. The on-line hot-dipping method is particularly suitable for production of tin-plated wires.

Description

technical field [0001] The invention relates to a method for coating the surface of metal wires, in particular to an online hot-dipping method for metal wires. Background technique [0002] People in the industry know that the hot-dip tinning treatment on the surface of metal wires is a process designed to make the wires have good solderability and anti-signal interference effects. In actual production, a layer of tin is attached to the surface of the metal wire during the process of melting tin in the tin bath to form a tin layer, and the hot-dip tinning process for the metal wire is completed. However, since the surface of the molten tin in the tin bath is easily oxidized to form a tin oxide film, when the metal wire leaves the tin bath, it has to pass through the tin oxide film, so that the surface inevitably carries the tin oxide film, Thereby reducing the appearance, oxidation resistance, solderability and other effects of the tinned wire. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): C23C2/38C23C2/08C23C2/14
Inventor 谢国锋
Owner 谢国锋