Electrostatic Chucks and Reaction Chambers
An electrostatic chuck and cavity technology, applied in the direction of circuits, discharge tubes, electrical components, etc., can solve the problems of unfavorable, small center hole, etc., achieve the effect of easy extraction, reduce the difficulty of processing, and solve the problems of thermal expansion and heat insulation
Active Publication Date: 2016-12-28
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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- Abstract
- Description
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- Application Information
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Problems solved by technology
In order to solve the mechanical stress caused by the difference in thermal expansion coefficients between the upper part of the chuck 550A and the lower part of the chuck 550B during heating, the position of the raised part 503 will be as close as possible to the center of the chuck, which will cause the center hole of the raised part 503 to be smaller and not Facilitate the extraction of heating wires and electrostatic attraction wires in the upper part of the chuck 550A
Method used
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Embodiment Construction
[0027] In order for those skilled in the art to better understand the technical solution of the present invention, the electrostatic chuck and the reaction chamber provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0028] image 3 It is a schematic structural diagram of an electrostatic chuck provided in Embodiment 1 of the present invention, Figure 4 for image 3 Schematic diagram of the structure of the middle support insulation, Figure 5 for image 3 Schematic diagram of the structure of the medium-sealed insulation, such as image 3 , Figure 4 and Figure 5 As shown, the electrostatic chuck includes: an electrostatic chuck assembly 1, a cooling element 2, a supporting heat insulating element 3 and a sealing heat insulating element 4, the electrostatic chuck assembly 1 is located above the cooling element 2, and the supporting heat insulating element 3 is arranged on Between the electrostatic chuck ass...
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The invention discloses a static chuck and a reaction chamber. The static chuck comprises a static chuck component, a cooling piece, a supporting heat insulation piece and a sealing heat insulation piece, the static chuck component is located above the cooling piece, the supporting heat insulation piece is arranged between the static chuck component and the cooling piece, the sealing heat insulation piece is arranged between the static chuck component and the cooling piece and are connected with the static chuck component and the cooling piece respectively in a sealing mode, the sealing heat insulation piece is located on the outer side of the supporting heat insulation piece, and an interval space is formed between the sealing heat insulation piece and the supporting heat insulation piece and is used for leading out wires. The static chuck lowers the leading-out difficulty of wires in the static chuck, greatly lowers processing difficulty and lowers processing cost.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to an electrostatic chuck and a reaction chamber. Background technique [0002] In the field of semiconductor processing, generally in a vacuum reaction chamber, a reaction material is formed on a wafer surface by an etching (Etch) process or a chemical vapor deposition (CVD) process. During this process, the wafer can be fixed on a specific position in the vacuum reaction chamber by a mechanical clamping device or an electrostatic chuck (ESC), and the process gas is transported into the vacuum reaction chamber through the pipeline, and the vacuum reaction chamber A radio frequency field (RF) in the chamber energizes the process gas into a plasma state. In the semiconductor production process, chucks are used to fix and support wafers to prevent wafer movement or misalignment during processing. Chucks may include mechanical chucks, vacuum chucks, or electrostatic chucks, am...
Claims
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IPC IPC(8): H01L21/683H01J37/32
CPCH01L21/6719H01L21/67207H01L21/6831
Inventor 聂淼
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD