Electronic component mounting equipment for circuit board production lines
A technology for installing electronic components and circuit substrates, which is applied in the direction of assembling printed circuits with electrical components, can solve the problem of underutilized racks, etc., and achieve the effects of simple structure, improved production efficiency, and high reliability
Active Publication Date: 2017-06-06
SHANDONG RIFA TEXTILE MACHINERY
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Problems solved by technology
In the existing road substrate installation equipment, two image capture systems are used, and the two image capture systems are distributed on both sides of the equipment, that is, one electronic component installation head corresponds to one image capture system, and the inside of the rack is not fully utilized.
Method used
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Embodiment Construction
[0017] In order to better understand the present invention, the implementation manner of the present invention will be explained in detail below in conjunction with the accompanying drawings.
[0018] Such as Figure 1 to Figure 4 As shown, an electronic component mounting equipment for a circuit substrate production line includes a frame 1, an electronic component supply device 2, a suction nozzle placement box 3, an image capture system 4, a circuit board conveying mechanism 5, an electronic component mounting head 6, X-direction moving device 7, MARK camera 8, and Y-direction moving device 9, for the convenience of description, it is stipulated that the direction of conveying circuit boards in the horizontal plane is the X direction, and the direction in which the vertical circuit boards are conveyed in the horizontal plane is the Y direction; the supply of electronic components shown The device 2, the suction nozzle placement box 3, the circuit board transmission mechanism...
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The invention discloses electronic component mounting equipment for a circuit substrate production line. The electronic component mounting equipment comprises a rack, an electronic component supplying device, a suction nozzle containing box, an image shooting system, a circuit board conveying mechanism, an electronic component mounting head, an X-directional mobile device, a MARK camera and a Y-directional mobile device. The electronic component supplying device, the suction nozzle containing box, the circuit board conveying mechanism and the Y-directional mobile device are respectively connected with the rack. The image shooting system is connected with an image shooting mobile device. The image shooting mobile device comprises a power source mounting bracket, a third guide rail, a third sliding block, a shaft coupling, a motor, screw rods and nuts, wherein the third guide rail is matched with the third sliding block, the third screw rod is matched with the third nut, the third screw rod is connected with the motor through the shaft coupling, and the power source mounting bracket is fixedly connected with the nuts. According to the electronic component mounting equipment for the circuit substrate production line, the image shooting mobile device is simple in structure and high in use reliability, so that resources are effectively utilized, and the cost of the mounting equipment for circuit substrates is lowered.
Description
technical field [0001] The invention relates to the technical field of circuit substrate production equipment, in particular to electronic component installation equipment for circuit substrate production lines. Background technique [0002] The circuit substrate production line includes printing equipment, gluing equipment, electronic component mounting equipment, and inspection equipment. Circuit substrate mounting equipment includes: electronic component mounting head, X-Y plane moving manipulator, electronic component supply device, image capture system, etc. Mounting of electronic components on a printed circuit board is carried out by suctioning the electronic components supplied by a component supply device (suction nozzle) by a component suction device (suction nozzle), and placing the suctioned electronic components Mounted on a printed circuit board printed with solder paste, and before assembly after this suction, after checking with a camera based on part recogn...
Claims
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IPC IPC(8): H05K3/30H05K3/34
Inventor 杨学正
Owner SHANDONG RIFA TEXTILE MACHINERY