Method for improving film formation uniformity of wafer

A uniformity and process technology, which is applied in the field of improving the film formation uniformity of process sheets in semiconductor vertical furnace equipment, can solve the problems of poor film formation uniformity, uneven temperature field and air flow field, etc., and achieves improved film formation uniformity, The effect of reducing production costs and optimizing film uniformity

Active Publication Date: 2014-07-16
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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AI Technical Summary

Problems solved by technology

During the process of raising or lowering the crystal boat, a small amount of oxygen (a small amount of oxygen) will be introduced into the oxidation furnace, which will form an uneven temperature field and air flow field in the oxidation furnace, and the rising or falling crystal boat will be affected. Influence, resulting in poor film uniformity

Method used

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  • Method for improving film formation uniformity of wafer

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Embodiment Construction

[0029] The method that the present invention improves the film-forming uniformity of process sheet, it comprises:

[0030] Step S01, introducing nitrogen gas into the hot oxidation furnace tube, and purging the inside of the furnace tube with nitrogen gas to create an environment;

[0031] Step S02, rotating the process chip carrier boat in the furnace tube at a low speed, and raising the boat from the original position to the process stroke position;

[0032] Step S03, keep rotating the craft sheet carrying boat, and perform the main oxidation process on the craft sheet;

[0033] Step S04, after the main oxidation process is completed, keep rotating the process sheet carrying boat, and lower the boat from the process stroke position to the original position.

[0034] The process chip carrier boat of the present invention is placed on the heat preservation barrel, and the heat preservation barrel is set on the quartz plate, and the rotating shaft passes through the process ga...

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Abstract

The invention discloses a method for improving the film formation uniformity of a wafer. The method comprises the steps that nitrogen gas is fed into a hot oxidizing furnace tube; a wafer holder is rotated; the wafer holder is lifted to a first position from the original position; the wafer holder keeps rotating, and a main oxidation process is conducted on the wafer; after the main oxidation process is completed, the wafer holder keeps rotating, and the wafer holder drops to the original position from a process stroke position. According to the method for improving the film formation uniformity of the wafer, the wafer holder keeps rotating at a low speed in the boat lifting process, the boat dropping process and the main oxidation process, as a result, the influence of nonuniform distribution of a temperature field and a gas flow field on the film formation uniformity of the wafer can be reduced, the film formation uniformity of the wafer in a semiconductor vertical furnace device is optimized, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a method for improving the film-forming uniformity of process wafers in semiconductor vertical furnace equipment. Background technique [0002] At present, the electronic information industry with integrated circuits as the core has surpassed the traditional industries represented by automobiles, petroleum, and steel to become the largest industry, and has become a powerful engine and solid foundation for transforming and pulling traditional industries into the digital age. In terms of integrated circuit processing and manufacturing, the feature size continues to shrink, which makes the integration of chips higher and higher, causing a series of technical obstacles and process problems. Integrated circuit processing and manufacturing is a technology closely related to special equipment, commonly known as "one generation of equipment, one generation of tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/316H01L21/67
CPCH01L21/02233H01L21/67248H01L21/67253
Inventor 黄自强
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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