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Minitype surface mounting type fuse protector

A surface mount and fuse technology, applied in emergency protection devices, electrical components, circuits, etc., can solve problems such as low efficiency, limited fuse shape design, and inapplicability, so as to reduce arcing and re-short-circuiting Risk, effect of increasing insulation resistance

Active Publication Date: 2014-07-30
SEMITEL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The monolithic process is to print one or more layers of melt on the ceramic green substrate through a thick film, and then cut it horizontally and vertically to form a green body of a single element, and then obtain it through co-firing, sealing and electroplating. Its advantages Its glass ceramics have strong arc extinguishing ability, so it can achieve a large breaking capacity. The disadvantage is that its production cycle is long, and there is a risk of mutual penetration when the fuse and the green body are co-fired, resulting in poor consistency; The resistance process is a very mature process. The basic process is to first provide an insulating substrate with front and back sides. There are horizontal and vertical grooves on the substrate, so as to divide the substrate into multiple rectangular units, and then each The surface electrode, the back electrode, the melt and the protective layer covering the melt are respectively formed on the unit, the substrate is divided into multiple substrates along the longitudinal groove, and the terminal internal electrodes are formed on the two sides of each substrate. Finally, each substrate is divided into multiple rectangular units according to the transverse grooves to obtain the required chips. The advantages are simple manufacturing process, short production cycle, and mass production. The disadvantage is that it cannot be used in high-voltage, high-voltage applications. In the reliability environment; the fuse that wears a metal wire in the insulator is the most common way to pass the fuse into the cavity of the ceramic body and then connect to the terminal electrode. The advantage is that the fuse has a large breaking capacity and consistency. Well, the disadvantage is that the fuse is small and easy to break, the wire threading process is complicated, the efficiency is low, it is difficult to produce in large quantities, and the shape of the fuse can be designed limited

Method used

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  • Minitype surface mounting type fuse protector
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  • Minitype surface mounting type fuse protector

Examples

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Embodiment

[0026] Embodiment: A miniature surface-mounted fuse, including a fuse chip 1, the fuse chip 1 is mainly composed of two terminal electrodes 2, a ceramic substrate 3, a first melt layer 4 and a first arc-extinguishing glass layer 5 , the first melt layer 4 is located on the upper surface of the ceramic substrate 3, the two terminal electrodes 2 are respectively located on both sides of the first melt layer 4 and are electrically connected to the first melt layer 4, the first An arc-extinguishing glass layer 5 covers the first melt layer 4 and the region near the melt layer in the terminal electrode 2;

[0027] The terminal electrode 2 is composed of a surface electrode 12, a back electrode 13 and a side electrode 14. The surface electrode 12 positioned on the upper surface of the ceramic substrate 3 is located on the side of the first melt layer 4, and the terminal electrode The area close to the first melt layer 4 in 2 is a part of the surface electrode 12, the back electrode ...

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Abstract

The invention discloses a minitype surface mounting type fuse protector which comprises a fusing chip. The fusing chip is mainly composed of two end electrodes, a ceramic substrate, a first fusing body layer and a first arc extinguishing glass layer, and a second arc extinguishing glass layer covers a second fusing body layer and the area, close to the second fusing body layer, in a back electrode. A metal layer is manufactured at the end of a fusing body with a circular through formed in the middle, the fusing chip is located in the circular through of the fusing body, two metal covers are located at the two ends of the fusing body respectively and cover the circular through hole of the fusing body to form a closed cavity, and the end electrodes are electrically connected with the metal covers through soldering terminals. Metal layers are arranged between the metal covers and the side faces of the fusing body. Glass enamel layers are arranged between the ceramic substrate, the first fusing body layer and the second fusing body layer. The minitype surface mounting type fuse protector reduces arc discharge and reduces risks of short circuit again after fusing, insulation resistance after fusing is enlarged, and the metal steam of the fusing body layers can be evenly absorbed by the arc extinguishing glass layers.

Description

technical field [0001] The invention relates to the technical field of fuses, in particular to a miniature surface-mounted fuse. Background technique [0002] Existing fuses and their manufacture include: fuses made by monolithic technology, fuses made by chip resistance technology and fuses with metal wires in the insulator. The monolithic process is to print one or more layers of melt on the ceramic green substrate through a thick film, and then cut it horizontally and vertically to form a green body of a single element, and then obtain it through co-firing, sealing and electroplating. Its advantages Its glass ceramics have strong arc extinguishing ability, so it can achieve a large breaking capacity. The disadvantage is that its production cycle is long, and there is a risk of mutual penetration when the fuse and the green body are co-fired, resulting in poor consistency; The resistance process is a very mature process. The basic process is to first provide an insulating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H85/041H01H85/05H01H85/38
Inventor 田伟龚建仇利民杨兆国
Owner SEMITEL ELECTRONICS
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