Substrate delivery system for RFID tag encapsulation

Abstract

The invention discloses a substrate delivery system for RFID tag encapsulation. The substrate delivery system comprises a feeding device, a first tension device, a first edge deviation correcting device, a second tension device, a third tension device, a second edge deviation correcting device, a cutting device, a receiving device and the like in sequence along a delivery path from an upstream end to a downstream end. Meanwhile, the key assemblies such as the tension devices, a counter point deviation correcting device, the receiving device and the cutting device are improved. According to the substrate delivery system for the RFID tag encapsulation, the different tension control requirements of a substrate can be better satisfied, and deviation correcting accuracy is improved to a greater extent. Meanwhile, the substrate delivery system has the technical advantages of being high in production efficiency, good in cutting quality and the like.

Description

technical field [0001] The invention belongs to the field of RFID tag manufacturing equipment, and more specifically relates to a substrate conveying system for RFID tag packaging. Background technique [0002] In the production process of RFID tags, it usually includes process steps such as antenna printing, label packaging, antenna detection, cutting and compounding. The function of the RFID tag package is to take the chip off the Wafer plate and attach it to the antenna, and then realize the Inlay package through thermal pressing and curing of the conductive adhesive. Packaging equipment is generally composed of dispensing modules, placement modules, hot-pressing modules, detection modules, and substrate conveying modules, among which the substrate conveying process and its control play a key role in the production quality of RFID tags. [0003] Some equipment related to the production of RFID tags and their applications are proposed in the prior art. For example, CN2012...

AI Technical Summary

Problems solved by technology

The integrated automatic deviation correction device is self-contained and cannot be integrated into the packaging equipment control system, which makes the operation of packaging equipment with multiple deviation correction devices inconvenient

In particular, the traditional deviation correction detection methods only have edge, center and line detection. All integrated automatic deviation correction devices of RFID label production equipment at home and abroad adopt these detection methods. These detection methods can only detect the position of the substrate, but In some processes of actual production, the position of the chip is the subject of monitoring, not the position of the substrate

In the thermal pressing module of RFID packaging equipment, if the gap between the actual lateral position of the chip on the substrate and the theoretical lateral position is too large, even if the lateral position of the substrate is accurate, it will cause thermal compression failure, thereby affecting product quality

[0005] In addition, when the substrate passes through the rollers between the mounting module and the hot pressing module, there will be deflection and deformation, which is very harmful to the uncured chip. How to reduce the influence of the rollers on the chip will be the key to improving the yield the key

On the other hand, the existing substrate conveying system of RFID label packaging equipment does not have the function of slitting. For some substrates that need to be slit, they can only be slit with a slitting machine after the packaging process is completed, which will cause low production efficiency. And increase label damage rate

Images