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Epoxy composition and epoxy resin molded article

A technology of epoxy composition and epoxy monomer, applied in the field of epoxy composition and epoxy resin molded body, can solve the problems such as unfavorable productivity of epoxy resin molded body, and achieve the effect of excellent thermal conductivity

Inactive Publication Date: 2014-08-06
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the specific production method described in Patent Document 1 is disadvantageous in terms of the productivity of the epoxy resin molded article, etc., in order to exhibit excellent thermal conductivity.

Method used

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  • Epoxy composition and epoxy resin molded article
  • Epoxy composition and epoxy resin molded article
  • Epoxy composition and epoxy resin molded article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0102] Terexylylene-bis-(4-amino-3-methylphenol) diglycidyl ether (DGETAM, epoxy equivalent weight: 228) and 4,4”-dihydroxy-3”-methyl-p- Terphenyl (DHTP-M, hydroxyl equivalent weight: 138) was dissolved in methyl ethyl ketone (MEK) so that the ratio of the number of epoxy groups derived from DGETAM to the number of hydroxyl groups derived from DHTP-M was 1:1, thereby preparing solution, and to the solution was added tetraphenyl tetraphenyl borate , so that its ratio relative to 100 parts by mass of DGETAM is 1 part by mass, thereby preparing the epoxy composition of Example 1.

[0103] The epoxy composition was poured into an aluminum cup and heated to a temperature of about 100°C, whereby the solvent (MEK) was removed to produce a dry solid.

[0104] Then, the dried solid was held in a vacuum chamber at 150° C. for 10 minutes in a state placed on a glass plate, thereby performing melting and defoaming.

[0105] A spacer was placed around the glass plate, and another glass ...

Embodiment 2

[0109] Terexylylene-bis-(4-amino-3-methylphenol) diglycidyl ether (DGETAM, epoxy equivalent weight: 228) and 4,4',4"-methylenol (TrisP -PHBA, hydroxyl equivalent weight: 97) was dissolved in methyl ethyl ketone (MEK) so that the ratio of the number of epoxy groups derived from DGETAM to the number of hydroxyl groups derived from TrisP-PHBA was 1:1 to prepare a solution, and to tetraphenyl borate , so that its ratio relative to 100 parts by mass of DGETAM is 1 part by mass, thereby preparing the epoxy composition of Example 2.

[0110] The epoxy composition was poured into an aluminum cup and heated to a temperature of about 100°C, whereby the solvent (MEK) was removed to produce a dry solid.

[0111] Then, the dried solid was held in a vacuum chamber at 150° C. for 10 minutes in a state placed on a glass plate, thereby performing melting and defoaming.

[0112] A spacer was placed around the glass plate, and another glass plate was further placed thereon, followed by holdin...

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Abstract

The present invention relates to an epoxy composition and an epoxy resin molded article, and specifically provides an epoxy resin molded article excellent in thermal conductivity and an epoxy composition suitable for forming such an epoxy resin molded article. Namely, the present invention relates to an epoxy composition containing an epoxy monomer having a mesogenic skeleton and a phenolic curing agent having a triphenyl methane structure.

Description

technical field [0001] The present invention relates to an epoxy composition and an epoxy resin molded body, and more particularly to an epoxy composition comprising a curing agent and an epoxy monomer and an epoxy resin molded body formed from the epoxy composition. Background technique [0002] A cured material thereof of an epoxy composition comprising an epoxy monomer and a curing agent has hitherto been widely used as a material for forming molded objects such as semiconductor packages and electrical insulating materials. [0003] In recent years, epoxy resin moldings such as semiconductor packages and electrical insulating materials have been required to exhibit excellent thermal conductivity, and inorganic fillers having excellent thermal conductivity such as nitrogen have been mixed into epoxy compositions for forming epoxy resin moldings. boron oxide and aluminum oxide. [0004] In such an epoxy composition, an epoxy resin molded article having better thermal condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08G59/24
CPCC08G59/28C08G59/621
Inventor 福崎沙织泉谷诚治山口美穗
Owner NITTO DENKO CORP