Halogen-free resin composition, and prepreg and laminated board prepared from same

A resin composition and prepreg technology, which is applied in the fields of electronic materials, integrated circuit packaging, high-frequency, high-speed and high-density interconnection, can solve the problems of increasing moisture absorption rate and decreasing electrical properties, and achieve improved moisture and heat resistance, resistance Good hygroscopicity and low dielectric constant effect

Active Publication Date: 2014-08-06
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent application CN102838841A discloses a resin composition, which contains active ester, nitrogen-containing epoxy resin and phosphorus-containing halogen-free flame retardant, which has good flame retardant performance, but the active e...

Method used

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  • Halogen-free resin composition, and prepreg and laminated board prepared from same
  • Halogen-free resin composition, and prepreg and laminated board prepared from same
  • Halogen-free resin composition, and prepreg and laminated board prepared from same

Examples

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Synthetic example 1

[0044] Synthesis Example 1: Preparation of phosphorus-containing active ester compound

[0045] Weigh 0.6mol of 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene-10-oxide and 0.6mol of p-hydroxybenzaldehyde, add 65% mass Concentration of H 2 SO 4 , condensed and refluxed at 100°C for 3 to 5 hours, and then the mixture was washed with alcohol 4 to 6 times to obtain the pre-product; the above-mentioned pre-product was dissolved in toluene solution, and 0.2mol of benzoic acid was added. temperature conditions, add 0.05mol catalyst (AlCl 3 ), condensed and refluxed for 4 hours, and then after several times of washing, dried for 4 hours under vacuum at 105°C to obtain the desired phosphorus-containing active ester compound with an esterification rate of 70-80% and a phosphorus content of 6.4%. Phosphorus-containing active ester compound, denoted as C1, the specific structure is as follows:

[0046]

[0047] X= , Y=H, Z= , R is phenyl, R1=CH 3 , n is 3-5....

Embodiment

[0054] According to the weight ratio shown in Table 1, benzoxazine resin, epoxy resin, phosphorus-containing active ester compound, curing agent, curing accelerator, inorganic filler and solvent are added to the mixing tank, and the solid content of the glue is controlled to be 65%. , stirred evenly, and aged for 8 hours to make a resin composition glue; then impregnated the glass cloth in the above resin composition glue; then baked the impregnated glass cloth at 160°C for 5 minutes to form a prepreg; After the prepreg is cut to a certain size, 8 prepregs are superimposed to form a stack, and an electrolytic copper foil is placed on the top and bottom of the stack, and sent to a vacuum press for pressing. The program is 150°C / 60min+200°C / 120min, a laminated board was prepared.

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Abstract

The invention discloses a halogen-free resin composition, and a prepreg and laminated board prepared from the same. The halogen-free resin composition comprises the following components in parts by weight (on solid basis): 10-50 parts of benzoxazine resin, 10-60 parts of epoxy resin, 15-50 parts of phosphorus-containing active ester compound, 0-40 parts of curing agent and 0-3 parts of curing accelerator. The phosphorus-containing active ester compound is prepared by reacting organic phosphorus compound with benzoic acid compound at 90-130 DEG C. The halogen-free resin composition has the advantages of favorable heat resistance, low dielectric constant and low hydroscopicity, and solves the problems of poor dielectric properties and low hydroscopic property caused by halogen-free flame retardancy; and the laminated board prepared from the resin composition is suitable for high-performance printed wiring boards for high-density interconnection integrated circuit packaging.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a halogen-free resin composition, and a prepreg and a laminate made of the composition, which are applied in the fields of integrated circuit packaging, high-frequency high-speed and high-density interconnection, and the like. Background technique [0002] Today, with the rapid development of information technology, electronic products are constantly developing in the direction of thinner, thinner and higher reliability. The application of high-density interconnection (HDI) technology has become the mainstream of printed circuit board manufacturing technology, the core of which is the miniaturization of through holes and the refinement of wires. The development of technology requires that the base material for making printed circuit boards must have high characteristic impedance, that is, low dielectric constant; from the perspective of the process conditions of printed...

Claims

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Application Information

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IPC IPC(8): C08L79/04C08L63/00C08K13/02C08K5/53C08K3/36C08J5/24C08G59/40B32B15/092B32B27/04B32B27/06B32B27/18B32B27/38
CPCB32B15/092B32B27/04B32B27/06B32B27/18B32B27/38B32B2307/3065B32B2363/00B32B2379/00B32B2457/08C08G59/40C08J5/24C08J2363/00C08J2379/04C08J2463/00C08J2479/04C08L63/00C08L79/04C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08K5/5313C08K3/36
Inventor 崔春梅戴善凯肖升高季立富黄荣辉谌香秀
Owner SHENGYI TECH SUZHOU
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