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Bridging capacitive touch panel structure and fabrication method for same

A capacitive touch and panel technology, which is applied to the input/output process of electrical digital data processing, instruments, and data processing, etc. parameters, the effect of reducing thickness

Inactive Publication Date: 2014-08-06
SHANDONG HUAXIN FUCHUANG ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the etch depth can be controlled, if figure 2 As shown, the etched part covers the underlying transparent conductive layer, thus, the etchant will affect the formed functional layer below, which is easy to cause damage to the formed functional layer and subsequent re-production, resulting in repetitive work. , affecting product efficiency and product yield

Method used

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  • Bridging capacitive touch panel structure and fabrication method for same
  • Bridging capacitive touch panel structure and fabrication method for same
  • Bridging capacitive touch panel structure and fabrication method for same

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Embodiment Construction

[0031] In order to make those skilled in the art understand more clearly the utility of the inventive principle and specific means of the present invention. The technical means, creative features, goals and effects achieved by the present invention are easy to understand, and the present invention will be further elaborated below in conjunction with specific drawings.

[0032] At figure 1 In the structure shown, the position of the first connecting portion 6 is at the bottom, and relatively speaking, the position of the insulating layer is at the top. For another example, when the second direction is used as a reference, the length direction of the insulating layer is the second direction, figure 1 In the horizontal direction, the width direction is the first direction, that is, figure 1 The paper normal in .

[0033] In the field of touch panel technology, the substrate is usually a transparent material, such as a glass-based substrate. Therefore, the substrate is also ref...

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Abstract

The invention discloses a bridging capacitive touch panel structure and a fabrication method for the same. A transparent conducting layer is covered with an etching barrier layer to protect the transparent conducting layer, and during the fabrication of a connection layer, the etching barrier layer can be effectively protected. Compared with the prior structure, the thickness of an insulation layer is reduced appropriately to be matched with the capacitor dielectric constant and meet the capacitive screen operating parameters.

Description

technical field [0001] The invention relates to a bridge-type (also called bridge-type, bridge-type) capacitive touch panel structure and a manufacturing method of the touch panel structure. Background technique [0002] The bridge-type capacitive touch panel structure is different from the capacitive touch panel structure with double transparent conductive layers. The transparent conductive layer used to form the touch function is only one layer, and the process requires a large number of photomasks. Due to the lack of protection such as an insulating layer, an open circuit or a short circuit will occur during the etching or exposure process, and the product yield is relatively difficult to control. [0003] Conventional bridge-type capacitive touch panel structure, such as figure 1 with figure 2 As shown, the substrate, shielding layer and other structures are omitted in the figure to clearly express the bridge point structure. figure 1 with figure 2 In, patterning o...

Claims

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Application Information

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IPC IPC(8): G06F3/044
Inventor 林锦源
Owner SHANDONG HUAXIN FUCHUANG ELECTRONICS SCI & TECH