LED heat radiation structure formed by mixing heat conducting insulation powder and resin and LED linear lamp

A LED linear lamp, heat conduction and insulation technology, applied in the direction of lampshade, lighting and heating equipment, components of lighting devices, etc., can solve the problems of insufficient heat dissipation, low efficiency, high cost, etc.

Inactive Publication Date: 2014-08-20
王定锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Usually, LED linear lights, such as LED tubes, are pasted with an aluminum strip under the light source module of the circuit board to conduct he...

Method used

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  • LED heat radiation structure formed by mixing heat conducting insulation powder and resin and LED linear lamp
  • LED heat radiation structure formed by mixing heat conducting insulation powder and resin and LED linear lamp
  • LED heat radiation structure formed by mixing heat conducting insulation powder and resin and LED linear lamp

Examples

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Embodiment Construction

[0030] A specific embodiment of an LED linear lamp with an LED heat dissipation structure mixed with thermally conductive insulating powder and resin will be described in more detail below.

[0031] However, those skilled in the art should understand that the following are only examples and descriptions of some preferred implementations, and other similar or equivalent implementations can also be used to implement the present invention.

[0032] For example: will be as figure 1 As shown in the LED light source module circuit board (1), the LED lamp (2) is welded on the circuit board (1) through the traditional SMT mounting and welding process (such as figure 2 shown).

[0033] For example, 48% of alumina powder and 52% of PVC rubber are uniformly mixed, and additives are added to knead to form granular high thermal conductivity material 3 .

[0034] Use an extruder to extrude the high thermal conductivity material and the LED circuit board light source module together, and ...

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PUM

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Abstract

The invention relates to an LED linear lamp with an LED heat radiation structure formed by mixing heat conducting insulation powder and resin. The LED linear lamp comprises an LED light source module circuit board (1), the heat radiation structure and an outer shell. The heat radiation structure is formed by adopting the heat conducting insulation powder and the resin for granulation and attaching the powder and the resin to an LED light source circuit module in an extrusion forming mode. The outer shell is formed by extruding light-transmitting resin, and at least part of the outer shell covers the LED light source module circuit board (1). Therefore, the LED linear lamp with high heat conduction is provided, heat generated when LEDs work is fast transmitted to the heat radiation structure through the circuit board for being radiated out, the LED temperature can be controlled to be very low, the brightness of the LED linear lamp can be higher, and light attenuation is small. The LED linear lamp can be widely used for manufacturing LED neon lamps high in heat conduction and high in brightness, LED lamp strips high in brightness, LED lamp tubes high in brightness and the like.

Description

technical field [0001] The invention relates to the field of LED decorative lighting. More specifically, the present invention relates to an LED linear lamp with an LED heat dissipation structure mixed with thermally conductive insulating powder and resin. Background technique [0002] Usually, LED linear lights, such as LED tubes, are pasted with an aluminum strip under the light source module of the circuit board to conduct heat and dissipate heat. This method is inefficient and high in cost; Thin, the heat dissipation is not enough if it is thin, and it cannot be bent if it is thick. [0003] Therefore, in order to overcome the above defects and deficiencies, in order to adapt to large-scale simple automatic production, the present invention uses thermally conductive insulating powder such as aluminum oxide, or silicon oxide, or zinc oxide, or magnesium oxide, or aluminum nitride, or boron nitride , or silicon carbide, or magnesium oxide, or quartz powder, or beryllium ...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V3/04F21V29/00F21V23/00F21Y101/02F21K9/27F21Y103/10F21Y115/10
Inventor 王定锋徐文红
Owner 王定锋
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