LED heat radiation structure formed by mixing heat conducting insulation powder and resin and LED linear lamp
Patent Information
- Authority / Receiving Office
- CN ยท China
- Current Assignee / Owner
- ็ๅฎ้
- Publication Date
- 2014-08-20
- Estimated Expiration
- Not applicable ยท inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of LED decorative lighting. More specifically, the present invention relates to an LED linear lamp with an LED heat dissipation structure mixed with thermally conductive insulating powder and resin. Background technique
[0002] Usually, LED linear lights, such as LED tubes, are pasted with an aluminum strip under the light source module of the circuit board to conduct heat and dissipate heat. This method is inefficient and high in cost; Thin, the heat dissipation is not enough if it is thin, and it cannot be bent if it is thick.
[0003] Therefore, in order to overcome the above defects and deficiencies, in order to adapt to large-scale simple automatic production, the present invention uses thermally conductive insulating powder such as aluminum oxide, or silicon oxide, or zinc oxide, or magnesium oxide, or aluminum nitride, or boron nitride , or silicon carbide, or magnesium oxide, or quartz powder, or beryllium ...