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LED packaging material and preparation method thereof

A technology of LED encapsulation and chlorophenyl silicone oil, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as reducing the brightness of light-emitting diodes, and achieve the effect of increasing the refractive index

Inactive Publication Date: 2014-08-27
SUZHOU INST OF TRADE & COMMERCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the use of light-emitting diodes, the performance requirements of the packaging materials of light-emitting diodes are relatively high. For example, they need to have a better refractive index. If the refractive index is low, the brightness of light-emitting diodes will be significantly reduced.

Method used

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  • LED packaging material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] (1) Take 15kg of chlorophenyl silicone oil, 12kg of methyl ethoxy silicone oil, 9 kg of dimethyl siloxane, and 5 kg of magnesium isooctanoate, mix chlorophenyl silicone oil, methyl ethoxy silicone oil, dimethyl The four ingredients of base siloxane and magnesium isooctanoate are dissolved after heating, and stirred until they are evenly mixed; (2) add 4 kg of curing agent diethylaminopropylamine and 22 kg of novolac epoxy resin, and stir evenly; (3) add The mixture was degassed in a vacuum degassing machine for 3 hours; (4) the mixture was put into a mold for curing at a curing temperature of 140° C., and cooled to room temperature after curing to prepare an LED packaging material.

Embodiment 2

[0014] (1) Take 19kg of chlorophenyl silicone oil, 6kg of methyl ethoxy silicone oil, 10kg of dimethyl siloxane, and 3kg of magnesium isooctanoate, mix chlorophenyl silicone oil, methyl ethoxy silicone oil, dimethyl The four ingredients of base siloxane and magnesium isooctanoate are dissolved after heating, and stirred until mixed evenly after dissolving; (2) add 6 kg of curing agent diethylaminopropylamine and 18 kg of novolac epoxy resin, and stir evenly; (3) add The mixture was degassed in a vacuum degassing machine for 3 hours; (4) the mixture was put into a mold for curing at a curing temperature of 150° C., and cooled to room temperature after curing to prepare an LED packaging material.

Embodiment 3

[0016] (1) Take 17kg of chlorophenyl silicone oil, 9kg of methyl ethoxy silicone oil, 8 kg of dimethyl siloxane, and 4 kg of magnesium isooctanoate, mix chlorophenyl silicone oil, methyl ethoxy silicone oil, dimethyl The four ingredients of base siloxane and magnesium isooctanoate are dissolved after heating, and stirred until they are evenly mixed; (2) Add 8kg of curing agent diethylaminopropylamine and 20kg of novolac epoxy resin, and stir evenly; (3) Add The mixture was degassed in a vacuum degassing machine for 3 hours; (4) the mixture was put into a mold for curing at a curing temperature of 145° C., and cooled to room temperature after curing to prepare an LED packaging material.

[0017] The refractive index, Shore hardness and bonding strength of the LED encapsulation materials of Example 1, Example 2, and Example 3 were measured, and the results are as follows.

[0018]

[0019] By optimizing the components of the packaging material, the physical properties of the ...

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Abstract

The invention relates to an LED packaging material and a preparation method of the LED packaging material. The LED packaging material comprises, by weight, 15 to 19 parts of chlorphenyl silicone oil, 6 to 12 parts of methyl-ethyloxy silicone oil, 4 to 8 parts of curing agent diethylaminopropylamine, 18 to 22 parts of novolac epoxy resin, 8 to 10 parts of dimethyl siloxane, and 3 to 5 parts of magnesium isooctanoate. The preparation process of the LED packaging material comprises the mixing step, the dissolution step, the degassing step and the solidification step. Therefore, the LED packaging material is obtained through preparation. The prepared LED packaging material has the high refractive index, hardness and bonding strength, and can be applied to light-emitting diodes as a light-emitting diode packaging material.

Description

technical field [0001] The invention relates to a polymer encapsulation material and a preparation method thereof, in particular to an LED encapsulation material and a preparation method thereof. Background technique [0002] Compared with traditional lighting tools, light-emitting diodes (LEDs) have many advantages. For example, the energy consumption is only about 10% of traditional light sources, and its preparation process is much less polluting than traditional lamps. With the development of economy and economy, light-emitting diodes will gradually replace traditional light sources and become new lighting tools. [0003] During the use of the light-emitting diode, the performance requirements of the packaging material of the light-emitting diode are relatively high. For example, it needs to have a good refractive index. If the refractive index is low, the brightness of the light-emitting diode will be significantly reduced. In addition, the hardness and bonding str...

Claims

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Application Information

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IPC IPC(8): C08L63/04C08L83/08C08L83/06C08G59/50C08K5/5419C08K5/098H01L33/56
Inventor 谢冬
Owner SUZHOU INST OF TRADE & COMMERCE