Manufacturing method of step circuit, circuit board including step circuit and manufacturing method of circuit board

Abstract

The invention provides a manufacturing method of a step circuit, a manufacturing method of a circuit board including the step circuit and the circuit board including the step circuit. The manufacturing method of the step circuit comprises the following steps: a first circuit layer is manufactured on a board of a carrier; a dielectric layer is manufactured on the board of the carrier, and the dielectric layer covers the first circuit layer and fills the board of the carrier among the first circuit layers such that one side of the dielectric layer contacting with the carrier and the first circuit layer form a board; the carrier is removed; and a second circuit layer is manufactured on the board formed by the side of the dielectric layer contacting with the carrier and the first circuit layer. The manufacturing method of the step circuit provided by the invention is simple to operate, and the step circuit is convenient to manufacture. Problems, such as under etching, open circuit, gap, oversized burrs and the like, existing in step drop parts between the first circuit and the second circuit can be effectively eliminated; manufacturing difficulty of the step circuit is reduced; and quality level of the circuit board is raised.

Description

technical field [0001] The invention relates to the field of production and manufacture of printed circuit boards, in particular to a method for manufacturing a ladder circuit, a method for manufacturing a circuit board containing a ladder circuit, and a circuit board including a ladder circuit. Background technique [0002] With the development of printed circuit boards in the direction of "light, thin, short and small", the trend of product diversification and modularization is becoming more and more obvious, and the requirements for circuit design and production methods of electronic products are also getting higher and higher. It is necessary to ensure that the circuit has good heat dissipation and precision and reliability, and it is also necessary to ensure that the product performance of all aspects of the circuit meets customer requirements. Therefore, a ladder line appears in the circuit board manufacturing process. The ladder line refers to the same or multiple lin...

AI Technical Summary

Problems solved by technology

[0005] In order to solve at least one of the above-mentioned technical problems, the present invention provides a method for manufacturing a stepped circuit, which can eliminate the problems of dirty etching, open circuits, gaps, and excessive burrs in the step drop portion, and reduce the difficulty of manufacturing the stepped circuit.

Images