Soft and hard multilayer circuit board and method for making electrical positioning hole thereof

Abstract

The invention discloses a soft and hard multiple-layer circuit board and a method for forming an electrical testing locating hole of the soft and hard multiple-layer circuit board. By the adoption of the soft and hard multiple-layer circuit board, the electrical measurement accuracy can be improved, the yield can be increased, and the testing cost can be reduced. The method for forming the testing locating electrical testing locating hole of the soft and hard multi-layer circuit board comprises the steps that a target ring is arranged at the positions, where the electrical testing locating hole is to be drilled, of the upper side and the lower side of the surface of a top-layer board body or a bottom-layer board body where bonding PADs are densely distributed, the target ring is imaged through a line film matched with the board body and is etched through the DES technology, a drone which is used for being identified by a drilling machine is arranged at the center of the target ring, and the drilling machine drills the electrical locating hole at the drone, wherein the line film is manufactured after expansion and shrinkage measurement and calculation are conducted on the soft and hard composite board. According to the method for forming the testing locating electrical testing locating hole of the soft and hard multi-layer circuit board, after measurement and calculation of the expansion and shrinkage values of the board are conducted, the correcting film is manufactured, and then the target ring is manufactured according the correcting film. By the adoption of the structure, when the electrical testing locating hole which is formed after correction is used for electrical tests of the multi-layer circuit board, the electrical testing accuracy is high, and the misjudgment rate of an open circuit and a short circuit is low; in this way, the production efficiency is improved, and testing cost can be reduced.

Description

technical field [0001] The invention relates to a soft and hard multi-layer circuit board, in particular to a soft and hard multi-layer circuit board with a low electrical measurement misjudgment rate and a method for manufacturing the electrical measurement positioning hole. Background technique [0002] With the continuous development and progress of science and technology, the performance requirements of circuit boards are getting higher and higher, especially for digital products, the frequency of design updates in terms of function and appearance is accelerating. [0003] As a high-tech product, soft and hard composite circuit boards with turbulence, ultra-thinness and light weight have been greatly developed and applied in the electronic field. At the same time, in today's rapid development of automation, in order to meet the convenience and light weight of digital products , Customers have higher and higher requirements for the wiring structure of flexible and rigid c...

AI Technical Summary

Problems solved by technology

During manual alignment, there is an alignment tolerance of less than 0.1mm between the line via hole and the PAD (referring to the soldering position on the soft-hard combination board); make the distance between the electrical positioning hole on the board and the circuit pad (referring to the electrical measurement The distance between the positioning hole and the center position of all pads deviates from the theoretical value of the corresponding design) and the standard value. Therefore, there is a certain deviation between the electrical measuring positioning hole drilled by the second drill and the originally designed electrical measuring positioning hole. It will also cause the electric measuring probe to be unable to accurately stick to the set position on the pad during electrical testing, thus resulting in a high misjudgment rate of the electrical measuring microneedle fixture test

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