Ultraviolet curable resin composition and peeling method of cured product thereof
A curing resin, ultraviolet technology, applied in non-polymer organic compound adhesives, nonlinear optics, instruments, etc., can solve the problems of scratches on the surface of the substrate, cost costs, and difficulty in recovering the substrate, and achieve good productivity. , the effect of less damage
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no. 1 approach
[0044] figure 1 It is a figure showing the optical member to which the peeling method of the present invention can be applied, figure 2 It is a process diagram showing the first embodiment of the process of peeling the layer obtained by curing the ultraviolet curable resin composition of the present invention from the surface of the optical substrate.
[0045] First, the optical member to which the process of this invention can be suitably applied is demonstrated.
[0046] Such as figure 1As shown, the optical member has a configuration in which the same or different optical substrates are bonded to both surfaces of a cured resin layer made of an ultraviolet curable resin composition.
[0047] Various materials can be used as the optical substrate, and specifically, PET, PC, PMMA, a composite of PC and PMMA, glass, COC, COP, plastic (acrylic resin, etc.), polarizing plate, lens sheet, Prism sheet, ITO glass, etc.
[0048] In addition, as the optical substrate, in addition...
no. 2 approach
[0095] Figure 4 It is a process diagram showing the second embodiment of the process of peeling the layer 3 obtained by curing the ultraviolet curable resin composition of the present invention from the surface of the optical substrate.
[0096] It should be noted that the same reference numerals are assigned to the same constituent members as those in Embodiment 1 described above, and description thereof will not be repeated here.
[0097] (preparation)
[0098] First, if Figure 4 As shown in (a), the cured resin layer 3 is cut without contacting the surface of the optical substrate using a cutting member such as a wire 4 whose thickness is smaller than that of the cured resin layer 3 .
[0099] (Process 1)
[0100] Such as Figure 4 As shown in (b), the peeling substrate is brought into contact with the layer 3 obtained by curing the ultraviolet curable resin composition. Specifically, the resin film 7 is used as a peeling base material, and is in contact with the sur...
no. 3 approach
[0107] Figure 5 It is a process diagram of the third embodiment showing the process of peeling the layer 3 obtained by curing the ultraviolet curable resin composition of the present invention from the surface of the optical substrate.
[0108] It should be noted that the same reference numerals are assigned to the same constituent members as those in Embodiment 1 described above, and description thereof will not be repeated here.
[0109] (preparation)
[0110] First, if Figure 5 As shown in (a), a force is applied to the bonded optical base material in a direction opposite to the direction in which the cured material layer 3 is formed, and the resin obtained by semi-curing so as to have a cured portion and an uncured portion is cured. Layer 3 was peeled off and cut off.
[0111] (Process 1)
[0112] Such as Figure 5 As shown in (b), the peeling substrate is brought into contact with the layer 3 obtained by semi-curing the ultraviolet curable resin composition. Speci...
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Abstract
Description
Claims
Application Information
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