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Structure and method for testing Young modulus of polycrystalline silicon thin film material

A polysilicon thin film, testing structure technology, applied in the direction of analyzing materials, measuring devices, instruments, etc., can solve the problems of uncertainty and instability in device design and performance prediction, and achieve stable testing process and testing parameter values. Simple calculation method

Inactive Publication Date: 2014-09-10
SOUTHEAST UNIV
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Problems solved by technology

[0002] The performance of microelectromechanical devices is closely related to material parameters. Due to the influence of processing, some material parameters will change. These uncertain factors caused by processing technology will make device design and performance prediction uncertain and unstable. Case

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  • Structure and method for testing Young modulus of polycrystalline silicon thin film material
  • Structure and method for testing Young modulus of polycrystalline silicon thin film material
  • Structure and method for testing Young modulus of polycrystalline silicon thin film material

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Embodiment Construction

[0026] Attached below figure 1 and figure 2 The present invention will be further described.

[0027] The invention provides a test structure for measuring the Young's modulus of a polysilicon film material. The test structure consists of two components, as figure 1 and figure 2 shown. figure 1 The first set of structures shown includes an electrostatically driven polysilicon cantilever beam 101, a first asymmetric cross beam 102 with an alignment structure, a second asymmetric cross beam 103 with an alignment structure; a second set of test structures such as figure 2 As shown, a polysilicon cantilever beam 101 and a first asymmetric cross beam 102 are included. Compared with the first group of test structures, the second group of test structures is the remaining part after removing the second asymmetric cross beam 103 in the first group of structures.

[0028] The polysilicon cantilever beam of the first group structure is composed of a first anchor region 101-1, a ...

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Abstract

The invention provides a structure and method for testing the Young modulus of a polycrystalline silicon thin film material, which are mainly used for testing the materials of polycrystalline silicon structure layers. The testing structure comprises two structures, wherein the first structure comprises an electrostatic driven polycrystalline silicon cantilever beam (101), a first asymmetric cross beam (102) which is made from a thin film material to be tested and is provided with an alignment structure, and a second asymmetric cross beam (103) made from the thin film material to be tested; the second structure comprises the remaining structures of the first structure except the second asymmetric cross beam; the stress of the material and the deflection of deformation or bending caused because the structure is stressed usually need to be known to measure the Young modulus of the material. The bending deflection of the testing structure is controlled by designing the geometric parameters, the force borne by the Young modulus testing structure is extracted according to the principle that the same parts of the two testing structures have the same stress, and the Young modulus of the polycrystalline silicon thin film material is computed by utilizing the force and the deflection. The testing structure, the measuring method and a parameter extraction method are extremely simple.

Description

technical field [0001] The invention provides a test structure for the Young's modulus of a polysilicon film material. The invention belongs to the technical field of microelectromechanical system (MEMS) material parameter testing. Background technique [0002] The performance of microelectromechanical devices is closely related to material parameters. Due to the influence of processing, some material parameters will change. These uncertain factors caused by processing technology will make device design and performance prediction uncertain and unstable. Case. The purpose of material parameter testing is to be able to measure the material parameters of MEMS devices manufactured by a specific process in real time, monitor the stability of the process, and feed back the parameters to the designer so that the design can be corrected. Therefore, testing without leaving the processing environment and using general-purpose equipment has become a necessary means of process monitor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/00G01N3/02
Inventor 李伟华王雷张璐周再发
Owner SOUTHEAST UNIV
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