Formation method of semiconductor structure
A semiconductor and conductive plug technology, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of poor morphology of conductive plugs, short circuit or open circuit of integrated circuits, etc., and achieve smooth surface, accurate graphics, Flat and smooth surface effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0030] As mentioned in the background art, with the improvement of the integration level of integrated circuits, the conductive plugs formed in the prior art have poor morphology, which may easily cause problems such as short circuit or open circuit of the integrated circuit.
[0031] The inventors of the present invention found that with the integration of integrated circuits increasing and the size of semiconductor devices shrinking, the required conductive plugs 105 (such as Figure 4 shown) also continues to decrease in size; in the prior art, it is necessary to firstly image 3 As shown) a photoresist layer 104 is formed on the surface (such as image 3 shown), and use the photoresist layer 104 as a mask to etch to form an opening, and form a conductive plug 105 in the opening; however, as the size of the conductive plug 105 continues to decrease, the dielectric layer The roughness of the surface of 103 has a more serious impact on the exposure process for forming the ph...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 
