Quantitative powder-filling device for sintering-type heat pipes

Abstract

The invention discloses a quantitative powder-filling device for sintering-type heat pipes. The quantitative powder-filling device comprises a bilateral symmetry V-shaped rack, a touch screen control panel, a funnel positioning device and two sets of powder-filling core mechanisms, the touch screen control panel is arranged in the middle of the rack, the two sets of powder-filling core mechanisms are arranged on the rack in a bilateral symmetry mode, the powder-filling core mechanisms comprise powder storing tanks, automatic powder inlet mechanisms, pressing mechanisms, powder-filling platform main panels, fixed middle plates, positioning plates, vibrating mechanisms and intermittent rotation devices which are sequentially arranged on the rack from top to bottom, the pressing mechanisms are used for pressing core rods, the powder-filling platform main panels are used for placing the heat pipes, and the touch screen control panel is respectively connected with the vibrating mechanisms, the intermittent rotation devices and the automatic powder inlet mechanisms in a circuit mode. The quantitative powder-filling device for the sintering-type heat pipes has the advantages that the automation degree is high, the controlling is accurate, requirements for operators are low, the labor intensity of the operators is reduced, the operation is convenient, the production efficiency is high, meanwhile, waste of raw materials such as copper powder can be reduced, flying dust is reduced, and the operating environment is improved.

Description

technical field [0001] The invention belongs to the field of heat pipe production equipment, in particular to a sintered heat pipe quantitative powder filling equipment. Background technique [0002] Driven by the rapid development of science and technology, according to Moore's Law, the number of transistors in an electronic chip doubles every 18 months. The contradiction has become a bottleneck restricting the development of electronic chips, and micro heat pipe radiators with high-efficiency heat transfer capabilities are the technical trend to solve this type of problem. Micro heat pipe technology is a research hotspot in the field of international microelectronics and heat transfer. It is not only of great significance in academic research, but also has broad application prospects in engineering, especially in the fields of microelectronics and aerospace. [0003] In the powder filling process of sintered micro-heat pipe liquid-absorbing core manufacturing, the current...

AI Technical Summary

Problems solved by technology

[0004] (1) In mass production, a large amount of manpower is required, and the degree of automation is low;

[0005] (2) The mandrel is easy to loosen during vibration, resulting in eccentricity, making the thickness of copper powder uneven and affecting the performance of the heat pipe;

[0006] (3) Due to defects in equipment and management, the waste of raw materials such as copper powder is quite serious;

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