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Method for Locating Open Circuits in Test Structures

A technology of testing structure and positioning method, which is applied in the direction of semiconductor/solid-state device testing/measurement, etc., to achieve the effect of rapid positioning

Active Publication Date: 2016-08-17
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since electromigration test structures are often 100 microns by 100 microns or more in size, it takes a long time to find defects smaller than 1 micron.

Method used

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  • Method for Locating Open Circuits in Test Structures
  • Method for Locating Open Circuits in Test Structures
  • Method for Locating Open Circuits in Test Structures

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Embodiment Construction

[0044] The open circuit location method of the test structure of the present invention will be described in more detail below in conjunction with schematic diagrams, wherein a preferred embodiment of the present invention is represented, it should be understood that those skilled in the art can modify the present invention described here, and still realize the present invention beneficial effect. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0045] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific goals, suc...

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Abstract

The present invention provides a method for locating an open circuit of a test structure, comprising: first performing step 1: providing a test structure, the test structure including a cathode terminal and an anode terminal; then performing step 2: grounding the cathode terminal, and separately Carrying out the voltage contrast check on the cathode terminal and the anode terminal, if the voltage contrast of the cathode terminal is bright and the voltage contrast of the anode terminal is dark, then proceed to step 3: check the cathode terminal and the anode terminal Sections of the test structure between the anode terminals are prepared in sections, voltage contrast inspections are performed on the section sections of the test structure respectively, and an open circuit of the test structure is judged according to the voltage contrast of the section sections of the test structure Location. The method can accurately and quickly locate the location of the circuit breaker in the test structure.

Description

technical field [0001] The invention relates to the field of reliability (Reliability) in the semiconductor manufacturing industry, in particular to a method for locating an open circuit of a test structure. Background technique [0002] Electromigration (EM for short) is a phenomenon of material transfer caused by the gradual movement of ions in a conductor, and its internal mechanism is the transfer of momentum between conductive electrons and diffused metal atoms. For occasions with high direct current densities (high direct current densities), such as in the field of microelectronics, the electromigration effect is very critical. As the size of integrated circuit products continues to decrease, the practical significance of electromigration effects continues to increase. When electromigration occurs, part of the momentum of a moving electron is transferred to a neighboring activated ion, which causes the ion to leave its original position. Over time, this force causes ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
Inventor 陈强
Owner SHANGHAI HUALI MICROELECTRONICS CORP