Wire welding point strengthening method of semiconductor device

Abstract

The invention provides a wire welding point strengthening method of a semiconductor device. A wire is welded to a welding area on the surface of a lead in a framework; a pressing element is connected with the welding point portion of the lead and the wire in the framework in a crossed mode, so that the middle of the pressing element moves to one side of the lead in the framework to press the wire, and the parts, located on the two sides of the wire, of the pressing element are welded and fixed to the lead in the framework. The pressing element is arranged on the welding point of the wire, so that the wire is pressed to one side of the lead in the framework. By means of the structure, interface combination between the front side of the lead in the framework and packing and molding materials is improved. When layers extend to the welding point of the wire, the layers can continue to extend to the welding point of the wire after the welding point of the pressing element completely peels due to extending of the layers, and accordingly peeling of the welding point of the wire can be prevented due to the structure.

Description

technical field [0001] The invention relates to the technical field of packaging of semiconductor devices, in particular to a method for strengthening solder joints of semiconductor devices. Background technique [0002] In the packaging process of semiconductor power devices, aluminum wires, aluminum strips and other wires are mainly used to achieve effective welding between the chip and the inner leads of the lead frame to meet the high electrical performance requirements such as high voltage and high current when the power device is working. After aluminum wire bonding as figure 1 , figure 2 As shown, it includes: a frame carrier table 1 for heat dissipation and carrying chips 2; lead wires 3 in the frame for electrical connection; aluminum wires 4 for connecting the chip 2 and lead wires 3 in the frame; Connected to the loading rubber 6 of the frame loading table 1. [0003] Due to the high internal temperature of the device when the power product is working, and som...

AI Technical Summary

Problems solved by technology

[0003] Due to the high internal temperature of the device when the power product is working, and sometimes the external working environment is relatively harsh, the welding reliability between the aluminum wire 4 and the lead wire 3 in the frame is required to be relatively high. Due to thermal stress, moisture, fluctuations in process quality control, etc., the aluminum wire 4 and the lead wire 3 in the frame will be peeled off, resulting in failure of the electrical parameters and functions of the product

In response to this failure, although the industry has improved welding reliability through bonding parameters, steel nozzle structure, materials, process layered control, etc., sometimes there will be a failure between the aluminum wire 4 and the lead wire in the frame, and subsequent improvements will be made. Process conditions are relatively limited

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