Wafer purifying equipment for eliminating etching byproduct coagulation defect of connecting hole

A technology for purifying equipment and by-products, applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems such as difficult cleaning, impure removal of defects, and reduced productivity, achieving a large process window and eliminating condensation Defects, the effect of ensuring productivity
CN104091776AActive Publication Date: 2014-10-08SHANGHAI HUALI MICROELECTRONICS CORP
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI HUALI MICROELECTRONICS CORP
Publication Date
2014-10-08

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Abstract

The invention discloses wafer purifying equipment for eliminating an etching byproduct coagulation defect of a connecting hole. The wafer purifying equipment is used for purifying a wafer after connecting hole etching is carried out on the wafer and before cleaning, spraying guns are arranged in a cavity of the wafer purifying equipment in different directions, and can simultaneously spray purifying gas to the wafer on a rotating wafer supporting platform, a dome-shaped exhaust pipe above the cavity and in the center of the inner wall exhausts the purified gas and etching byproducts carried by the purified gas in the cavity, and the purifying effect can be further improved through a gas stirring device or spraying nozzle arranged on each spraying gun. The wafer purifying equipment not only avoids damage to the wafer, especially for a CD, but also can eliminate etching byproducts attached to the wafer, thereby eliminating the coagulation defect generated by reaction of the etching byproducts and water when the etching byproducts wait to be cleaned.
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Description

technical field

[0001] The present invention relates to a kind of equipment for purifying semiconductor wafer, more specifically, relates to a kind of equipment used to eliminate the condensation defect of the by-product of connection hole etching after the connection hole etching process and before the cleaning process of the semiconductor wafer wafer purification equipment. Background technique

[0002] With the development of semiconductor integrated circuit technology and the scaling down of critical dimensions, semiconductor technology production will use more and more advanced processes. For example, for the connection hole etching process, the most advanced APF (advanced pattern film, advanced pattern film) process will be applied. At the same time, due to the reduction of CD, the etching reactants used will be more complex, and the composition of the by-products of etching poses a greater challenge to the subsequent cleaning process. For example, the etching by-pro...

Claims

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