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Novel power electronic module of three-dimensional structure

A power electronic module and three-dimensional structure technology, which is applied in the direction of circuits, electrical components, and electric solid devices, can solve the problem of low heat dissipation efficiency on one side, and achieve the effect of improving water cooling efficiency and improving balance

Inactive Publication Date: 2014-10-08
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually the power module has a planar structure, and the power module is directly installed on the water-cooled plate, but only one side of the water-cooled plate is used. This kind of planar power module has the defect of low heat dissipation efficiency on one side

Method used

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  • Novel power electronic module of three-dimensional structure
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  • Novel power electronic module of three-dimensional structure

Examples

Experimental program
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Effect test

Embodiment 1

[0013] figure 1 It is a novel power electronic module structure of the power device chip (insulated gate bipolar transistor (IGBT)) of the present invention, and the shell (11) is made of copper material, which connects the power output end of the IGBT with the output terminal, and its corresponding relationship is ( 7) c pole (8) e pole (9) g pole. figure 2 It is a hexagonal prism stack structure, which is mainly composed of (1) bonding wire, (2) power diode chip, (3) IGBT chip, (4) copper layer, (5) alumina ceramic and (6) copper substrate, the middle The cylindrical hollow part is put into a water pipe for water cooling. image 3 It is a side view of a hexagonal prism stack structure, which consists of (1) bonding wire, (2) power diode chip, (3) IGBT chip, (4) copper layer and (10) IGBT chip gate.

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PUM

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Abstract

The invention relates to a power electronic module, and discloses a power electronic module of a novel space structure. In the novel power electronic module, the module is of a hexagonal prism structure, chips are stacked on each lateral surface of the module, all the chips are connected in parallel through a copper piece surrounding the hexagon, the middle of the hexagonal prism is hollowed out into a cylinder, and a water pipe is arranged in the cylinder in a sleeved mode for water cooling. The hexagonal prism structure and the power electronic module are combined, the design of multi-chip paralleled current sharing is simplified, the heat radiation water pipe makes complete contact with a power module, and the heat radiation capacity of the power module is improved.

Description

technical field [0001] The present invention relates to the field of power electricity. The invention relates to a power electronic module, specifically, an insulated gate bipolar transistor (IGBT) power module. Background technique [0002] Insulated gate bipolar transistor-based power modules, in order to output more power, multi-chips need to be connected in parallel due to the mismatch between the parameters of each chip and the circuit parameters, which will lead to the problem of uneven current distribution when connected in parallel , in severe cases, it will cause overload and damage to the device, and the planar ceramic copper-clad (DBC) board structure in the planar power module is limited by the two-dimensional area, and there are many restrictions on the chip layout. [0003] In high-power modules, the parallel connection of multiple chips will generate a lot of heat, and it is necessary to cool them with water coolers to ensure their reliable operation. Usuall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/473
CPCH01L2224/48137
Inventor 江明明郭清徐嘉俊盛况
Owner ZHEJIANG UNIV
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