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MOS transistor and forming method thereof

A MOS transistor and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of drain induction barrier reduction, affecting transistor performance and reliability, source-drain punch-through, etc., to avoid source Drain punch-through effect, the effect of improving the short channel effect

Inactive Publication Date: 2014-10-29
SEMICON MFG INT (SHANGHAI) CORP
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Problems solved by technology

[0008] The MOS transistor formed by the existing technology is prone to lowering of the drain induction barrier and source-drain punch-through, which seriously affects the performance and reliability of the transistor.

Method used

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  • MOS transistor and forming method thereof
  • MOS transistor and forming method thereof

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Embodiment Construction

[0035] As mentioned in the background art, phenomena such as source-drain punch-through and drain induction barrier reduction of MOS transistors formed in the prior art will seriously affect the performance and reliability of the transistor.

[0036] Research has found that in the prior art, after the lightly doped region and the halo region of the transistor are formed, the source and drain of the transistor are formed using a SiGe or SiC source-drain process, and the short channel effect of the transistor is serious. The main reason is that in the process of forming the source and drain of the transistor, the semiconductor substrate needs to be etched to form grooves. When the semiconductor substrate is etched to form grooves, part of the previously formed halos will inevitably be removed. region, resulting in a reduction in the area of ​​the halo region, and a corresponding reduction in the diffusion barrier effect on source and drain dopant ions; After the halo region, par...

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Abstract

Provided are an MOS transistor and a forming method thereof. The method for forming the MOS transistor comprises the steps of providing a semiconductor substrate and enabling the surface of the semiconductor substrate to be provided with a grid structure; etching the semiconductor substrate on two sides of the grid structure to form grooves; forming a diffusion barrier layer on the surface of a side wall of one side of each groove close to the grid structure, enabling the diffusion barrier layer to cover two sides of a channel area; and forming sources and drains in the grooves. The method for forming the MOS transistor can improve short channel effect of the transistor and improve performance of the transistor.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a MOS transistor and a forming method thereof. Background technique [0002] With the continuous development of semiconductor technology, the degree of integration of integrated circuits is getting higher and higher, and the size of devices is also decreasing. However, the continuous reduction of device size has greatly affected the performance of the device. For example, when the length of the channel shrinks to a certain extent, the device begins to show short-channel effects, including the decrease of carrier mobility, the increase of threshold voltage, and the decrease of drain-induced barrier (DIBL). [0003] In the existing MOS manufacturing process, in order to suppress the short channel effect, lightly doped source / drain (LDD) and halo (Halo) implants are usually used to form a lightly doped region before the source / drain of the transistor is formed. and the halo...

Claims

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Application Information

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IPC IPC(8): H01L21/336H01L21/265H01L29/78
CPCH01L29/66636H01L29/0642H01L29/7816
Inventor 赵猛
Owner SEMICON MFG INT (SHANGHAI) CORP
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