MOS transistor and forming method thereof
A MOS transistor and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of drain induction barrier reduction, affecting transistor performance and reliability, source-drain punch-through, etc., to avoid source Drain punch-through effect, the effect of improving the short channel effect
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[0035] As mentioned in the background art, phenomena such as source-drain punch-through and drain-induced barrier reduction of MOS transistors formed in the prior art will seriously affect the performance and reliability of the transistor.
[0036] Studies have found that in the prior art, after forming the lightly doped region and the halo region of the transistor, the source and drain of the transistor are formed by the SiGe or SiC source-drain process, and the short channel effect of the transistor is serious. Mainly because in the process of forming the source and drain of the transistor, the semiconductor substrate needs to be etched to form a groove. When the semiconductor substrate is etched to form the groove, it is inevitable to remove some of the halo formed before. The area of the halo region is reduced, and the diffusion barrier to the source and drain doped ions is also reduced accordingly; and since the depth of the source and drain formed is greater than the depth...
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