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Test apparatus and test method for acoustic micro-device

A technology of testing equipment and testing methods, which is applied in the direction of measuring equipment, electrical components, and material analysis using acoustic wave emission technology, and can solve problems such as inaccurate intrinsic noise and difficult to maintain and isolate the testing environment

Active Publication Date: 2014-10-29
SOLID STATE SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the intrinsic noise of the device under test (DUT) is tested and the interference of environmental factors is included, the measured intrinsic noise will be inaccurate
Although the DUT can be tested in an environment that can isolate environmental factors, it is difficult to maintain an isolated test environment to test a large number of DUTs in an environment that isolates environmental factors, and therefore there will be a lot of inconvenience

Method used

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  • Test apparatus and test method for acoustic micro-device
  • Test apparatus and test method for acoustic micro-device
  • Test apparatus and test method for acoustic micro-device

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Embodiment Construction

[0056] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the following in conjunction with the accompanying drawings and preferred embodiments, the specific implementation of a sound micro-component testing device and testing method according to the present invention, Structure, characteristic and effect thereof are as follows in detail.

[0057] For MEMS DUTs, such as MEMS sound sensors, and such as MEMS microphones, it is necessary to detect the sound to determine the sensitivity of the induction and its noise level. The present invention proposes a mechanism for efficiently detecting DUTs.

[0058] A number of embodiments are presented below to describe the present invention, but the present invention is not limited to the cited embodiments. Also, these embodiments do not exclude embodiments that may be combined with each other.

[0059] figure 1 It is a schematic diagram of the testing ...

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Abstract

An acoustic micro-device testing apparatus including an acoustic device, at least one device under test (DUT), and a bearing plate is disclosed. The acoustic device provides a testing acoustic source to a first side of the DUT through the main channel and to a second side of the DUT through the side channel. The bearing plate has a first surface and a second surface. The first surface has a chamber sunken into the bearing plate. The second surface has a bearing space sunken into the bearing plate and bearing the DUT. The bearing plate has a main channel connecting the chamber and the DUT and at least one side channel connecting the chamber and the bearing space directly or through the main channel. A cover unit covers the bearing plate so that the bearing space and the chamber form a confined space. The DUT is in the confined space.

Description

technical field [0001] The present invention relates to a kind of testing of micro-components, and in particular relates to a testing device and a testing method for sound micro-components. Background technique [0002] Due to the development of semiconductor manufacturing technology, it can be integrated with mechanical systems to form micro-electromechanical systems (MEMS), which is an industrial technology that integrates microelectronics technology and mechanical engineering. [0003] In the application of mechanical systems, the microcomponents are, for example, mechanical system microphones. After the sound micro-component is manufactured, it is generally necessary to test the noise level. However, due to the sound micro components are easily disturbed by environmental factors. Environmental factors include, for example, vibration, ambient noise, temperature, humidity, pressure, and the like. If the intrinsic noise of the device under test (DUT) is tested and the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R29/00
CPCG01N29/30G01N29/14G01N29/4436G01N2291/0231
Inventor 操礼齐李建兴
Owner SOLID STATE SYST