Improved structure of coppered wire hang stripping recovery groove

Abstract

The invention discloses an improved structure of a coppered wire hang stripping recovery groove. The structure includes an electrolytic bath filled with an electrolytic solution, a plurality of flying targets and a plurality of copper boards. Two opposite side vertical side of the electrolytic bath are provided with a plurality of fixing bases which are arranged symmetrically at intervals. Each flying target is respectively positioned and fixed between each two symmetrical bases and is electrically connected to a positive pole of a power supply. Each flying target is provided with a coppering rack. Each copper board is electrically connected to a negative pole of the power supply and is arranged on an inner bottom surface of the electrolytic bath. Each copper board and each coppering rack is soaked in the electrolytic solution. Each flying target is connected to a shocking device which can drive the flying target to shock. In addition, at least one ultrasonic generator is provided, wherein the ultrasonic generator emits an ultrasonic wave which can act on the electrolytic solution in the electrolytic bath to generate wave. The structure is simple and environment-protective. Not only is recovery of copper achieved but also a production cost is saved.

Description

technical field [0001] The invention relates to the field of a copper recovery device, and specifically provides an improved structure of a recovery tank for stripping and hanging copper-plated wires. Background technique [0002] In the electroplating process of PCB production, because the PCB is hung on the flying target hanger of the electrolytic tank for electroplating, copper will also be plated on the flying target hanger. The existing technology is to use nitric acid to chemically peel off the copper layer, that is, to immerse the hanger in the nitric acid solution, and the copper on the surface of the hanger will be corroded by nitric acid and stripped off, but this method will be carried out on the hanger itself after the copper is stripped. Certain corrosion, and this method can not completely strip off the copper on the overall surface of the hanger; in addition, this method also consumes a large amount of nitric acid solution, which seriously pollutes the working...

AI Technical Summary

Problems solved by technology

The existing technology is to use nitric acid to chemically peel off the copper layer, that is, to immerse the hanging device in the nitric acid solution, and the copper on the surface of the hanging device will be corroded by nitric acid and stripped off, but this method will not remove the copper on the hanging device itself. Cert

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