Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for pouring glue into capacitive water level sensor

A water level sensor and capacitive technology, which is applied in the direction of liquid level indicators for physical variable measurement, can solve the problems of increasing the production cost of the circuit board and the small effective use area of ​​the circuit board, so as to increase the effective use area and reduce the production cost , enhance the effect of stress resistance

Inactive Publication Date: 2014-11-05
HUNAN YUHANG TECH
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, when the circuit board is fixed in the isolation sleeve by screws, the circuit board needs to reserve more space for the mounting screws, so that the effective use area of ​​the circuit board is small, which increases the production cost of the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for pouring glue into capacitive water level sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] refer to figure 1 , this embodiment includes the following steps:

[0022] S1: a circuit board installation cavity is provided in the isolation sleeve 2 of the capacitive water level sensor;

[0023] S2: put the circuit board 4 carrying the signal acquisition and conditioning circuit into the circuit board installation cavity along the vertical direction;

[0024] S3: Connect the pad P1 of the circuit board 4 to the copper pad 3 that senses the original capacitance data with the first high-temperature wire 5; solder the pad P2 of the circuit board 4 to the joint 1 with the second high-temperature wire 6; Connect the pad V+ of the circuit board 4 to the power line 7 of the capacitive water level sensor by soldering; connect the pad V- of the circuit board 4 to the ground wire 8 of the capacitive water level sensor; Vout is so...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for pouring glue into a capacitive water level sensor. The method for pouring glue into the capacitive water level sensor comprises the following steps that S1, a circuit board installation cavity is formed in a spacer sleeve of the capacitive water level sensor; S2, a circuit board with a signal acquiring and conditioning circuit is placed in the circuit board installation cavity in the vertical direction; S3, a bonding pad P1 of the circuit board and a copper pad used for sensing original capacitance data are connected through soldering by means of a first high-temperature wire, a bonding pad P2 of the circuit board and a connector are connected through soldering by means of a second high-temperature wire, a bonding pad V+ of the circuit board and a power line of the capacitive water level sensor are connected through soldering, a bonding pad V- of the circuit board and a ground wire of the capacitive water level sensor are connected through soldering, and a bonding pad Vout of the circuit board and an output wire of the capacitive water level sensor are connected through soldering; S4, epoxy resin glue is poured into the circuit board installation cavity until the circuit board is just submerged in the epoxy resin glue. By means of the method for pouring glue into the capacitive water level sensor, the vibration resistance, the pressure resistance and the waterproof performance of the capacitive water level sensor can be improved, and the manufacturing cost of the circuit board is effectively reduced.

Description

technical field [0001] The invention relates to a glue filling method for a capacitive water level sensor. Background technique [0002] The water level sensor is a sensor that measures the change of the water level. It mainly uses the change of the capacitance value between the two electrodes caused by the change of the water level to measure the water level. The water level sensor converts the capacitance value into an electrical signal through the signal acquisition and conditioning circuit, and outputs the voltage signal when there is water and no water. Water level sensors are mainly used for water level monitoring of various water tanks, such as water tower water tanks, automobile water tanks, and construction machinery water tanks, which require high vibration resistance, compression resistance and water resistance. [0003] At present, the circuit board of the capacitive water level sensor is mainly fixed in the isolation sleeve by screws, and the rubber sealing rin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01F23/26
Inventor 魏鹏旨王勐李辉瑛谢功贤
Owner HUNAN YUHANG TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com