LED lamp junction temperature prediction method based on separation-type simulation analysis
A technology of LED lamps and simulation analysis, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as complex junction temperature of LED lamps, achieve good practical value, simplify the modeling process, and improve the effect of accuracy
Active Publication Date: 2014-11-05
GUILIN UNIV OF ELECTRONIC TECH
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However, for LED lamps, it is quite complicated to accurately predict the junction temperature of LED lamps due to the influence of heat sink, optical structure, environment, etc.
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[0023] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0024] The present invention is a method for predicting the junction temperature of LED lamps based on separate simulation analysis. The process is as follows: figure 1 As shown, the specific implementation process is as follows:
[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0026] The present invention is a method for predicting the junction temperature of LED lamps based on separate simulation analysis. The process is as follows: figure 1 As shown, the specific implementation process is as follows:
[0027] 1) This implementation process takes the commercialized 12W LED indoor lighting downlight as an example, such as figure 2 As shown, at the same time, the power of each packaged device of the LED lamp is 0.32W.
[0028] 2) According to the so...
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The invention discloses an LED lamp junction temperature prediction method based on separation-type simulation analysis. First, parameters such as the structural size, the material and the working environment of a lamp are determined; second, the voltage and temperature characteristics of an LED packaging device used by the lamp are determined; third, a numerical value analysis model in which the structure of the LED packaging device is ignored is built, and the average temperature of the bottom of the LED packaging device is obtained through simulation analysis; fourth, a numerical value simulation analysis model of the LED packaging device is built, a series of equivalent convection heat dissipation coefficients with discrete numerical values are applied to the bottom face of the LED packaging device to perform simulation analysis, and the function relation between the convection coefficients and the average temperature of the bottom face of the LED packaging device is built through the analysis result; fifth, a numerical value analysis model of the packaging device of an LED lamp is built, the corresponding convection coefficient is calculated through an interpolation algorithm when the average temperature, generated when simulation analysis of the LED lamp is performed, of the bottom of the packaging device is equal to the average temperature, generated when simulation analysis of the LED packaging device is performed, of the bottom of the packaging device, and the junction temperature of the LED packaging device is worked out. The prediction accuracy of the junction temperature of the LED lamp is improved.
Description
technical field [0001] The invention relates to the junction temperature prediction technology of LED lamps, in particular to a method for predicting the junction temperature of LED lamps based on separate simulation analysis. Background technique [0002] As the most eye-catching new-generation light source in the world, LED is known as the most promising green lighting source in the 21st century because of its outstanding advantages such as energy saving, environmental protection, and longevity. In 2012, the Ministry of Science and Technology issued the "Twelfth Five-Year Special Plan for the Development of Semiconductor Lighting Technology" and proposed an industry scale of 500 billion yuan. However, the reliability life assessment problem of LED lighting products is an obstacle to its entry into general lighting. According to the latest CAS020 standard, it takes at least 2000 hours to evaluate the reliability of LED lamps using the accelerated test method ([Koh, S., et ...
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IPC IPC(8): G06F19/00G06F17/50
Inventor 杨道国田坤淼蔡苗陈文彬陈云超
Owner GUILIN UNIV OF ELECTRONIC TECH