Sapphire/ceramic lens laser-cutting method

A laser cutting and ceramic lens technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of high cost, non-environmental protection, long processing cycle, etc., achieve high product quality, protect the environment, and improve cutting quality Effect

Active Publication Date: 2014-11-19
LENS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem solved by the present invention is to provide a method for cutting sapphire / ceramic lenses by laser, which effectively solves the problem of laser cutting technology in the traditional sapphire / ceramic lens cutting. The above-mentioned problems on sapphire / ceramic lenses

Method used

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  • Sapphire/ceramic lens laser-cutting method

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Embodiment

[0023] In this embodiment, the present invention is described in detail by taking cutting a circular hole on a sapphire lens as an example.

[0024] Firstly, the sapphire slice with a thickness of 0.7-0.9mm is vacuum-adsorbed to the jig; specifically, the jig is provided with a hollowed-out annular space at the bottom of the round hole to be cut in the sapphire slice, and the depth is above 10mm. There is a supporting fixture in the middle position for supporting the cut round waste.

[0025] Set the fixture on the workbench of the fiber laser machine, and set the air nozzle of the laser head at the position of 0.15mm-0.3mm on the upper surface of the product. During the process of cutting round holes, the workbench moves along the Y line of the system, and the laser head moves along the Y line of the system. The X-axis moves, and the circular tool path of the laser head to the lens is realized by simultaneous simultaneous movement in two directions. A distance of 0.02-0.03mm ...

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Abstract

The invention discloses a sapphire/ceramic lens laser-cutting method. The sapphire/ceramic lens laser-cutting method includes that sapphire/ceramic slices 0.1mm-5mm in thickness are fixed on an optical fiber laser machine, a hollow space is arranged below a position for passing a sapphire/ceramic slice cutter; a cutter passing path of a laser head is set, the distance is reserved between a cutter inlet space and a cutter storage space; when the cutter of the laser head passes to cut, a focus of the laser head targets to the upper surface, the lower surface or the inside of each sapphire/ceramic slice, and during cutting, high-pressure gas wrapping laser beams is ejected together. By the aid of the laser cutting technology, processing efficiency is improved, auxiliary materials such as coolant and grinding wheel rods for conventional processing are saved, environment is protected, and cost of consumables is saved. Meanwhile, lens cutting accuracy is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of optical lens cutting, in particular to a method for laser cutting sapphire / ceramic lenses. Background technique [0002] Sapphire / ceramic lenses have been widely used in touch screen lenses of electronic products due to their high hardness and optical properties. With the diversified design of electronic products, the corresponding touch screen lens is no longer a complete lens, and various round or square holes need to be cut out on the lens for adding buttons, cameras or earphones. Sound outlet. [0003] The traditional method of cutting round holes and square holes on sapphire / ceramic lenses is to use CNC machine tools to grind and cut through grinding wheel rods. It is suitable for quantitative production, and during the grinding process, grinding fluid must be continuously added to cool down and assist grinding. The odor and noise generated will pose a great hidden danger to the health of workers, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/14B23K26/142B23K26/70
CPCB23K26/14
Inventor 周群飞饶桥兵徐学岩
Owner LENS TECH
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