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Preparation method of one-component epoxy chip encapsulation security adhesive

A chip packaging, one-component technology, used in epoxy resin glue, adhesives, polymer adhesive additives, etc., can solve the problems of easy scratching and easy theft of electronic circuit design, and achieves the protection of internal circuit design. Effect

Inactive Publication Date: 2017-01-11
厦门三顶新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a preparation method of a one-component epoxy chip encapsulation secret glue, to solve the problem that the existing IC chip encapsulation is easy to be scratched off and its electronic circuit design is easy to be stolen

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The present invention will be further described in detail below in conjunction with specific embodiments.

[0015] In order to solve the problems of existing single-component epoxy adhesives such as inability to withstand high temperature, poor thermal conductivity, and no flame retardancy, the present invention provides a method for preparing a single-component epoxy chip encapsulation security adhesive.

[0016] Specifically, the embodiment of the present invention includes the following steps:

[0017] First, prepare the materials as follows:

[0018] 45 parts by weight, for example, 45 kilograms, of epoxy resin preferably includes polyurethane-modified epoxy resin and cycloaliphatic epoxy resin (or organoboron epoxy resin). Among polyurethane-modified epoxy resins, Bisphenol F epoxy resin is 5 parts, AG-80 epoxy resin is 10 parts, and cycloaliphatic epoxy resin is 30 parts.

[0019] 5 parts by weight of a toughening agent, which is preferably a liquid carboxy-terminated nitr...

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Abstract

The invention provides a preparation method of a single-segmented epoxy chip packaging sealant. The preparation method comprises the following steps: preparing materials, namely epoxy resin which comprises 15 parts by weight of polyurethane epoxy resin and 30 parts by weight of cycloaliphatic epoxy resin, 5 parts by weight of flexibilizer, 5 parts by weight of diluent, 4 parts by weight of curing agent, 0.8 part by weight of accelerant, 0.08 part by weight of stabilizer, 0.2 part by weight of defoamer, 0.1 part by weight of flatting agent, 34 parts by weight of filler, at least 2 parts by weight of coupling agent and 12 parts by weight of flame retardant; preparing a curing agent pre-grinding paste, namely stirring 1 / 5 of the epoxy resin and 1 / 3 of each of the accelerant, the stabilizer, the defoamer and the filler together evenly, grinding twice and then discharging the material; stirring, namely stirring the curing agent pre-grinding paste and the left materials until all the materials are mixed evenly and fine, and pumping vacuum. The sealant prepared by the method is capable of well protecting the internal circuit design of an IC chip.

Description

Technical field [0001] The invention relates to the technical field of chip packaging and adhesives, in particular to a method for preparing a single-component epoxy chip packaging security adhesive with high temperature resistance, high thermal conductivity, halogen-free flame retardant properties. Background technique [0002] At present, many IC (integrated circuit) electronics manufacturers and electronic equipment scientific research organizations report that for some devices with IC chips, the electronic circuit design of the chip is easily cracked and difficult to keep secret, and it is difficult to obtain reliable knowledge about the stolen electronic circuit design. Property rights protection. Because the traditional one-component epoxy adhesive cannot withstand high temperature, poor thermal conductivity, and no flame retardant, it is heated to 150 degrees in an oven and scraped off with a blade to expose the IC chip, resulting in the use of traditional one-component ep...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/08C09J11/06C09J11/04
Inventor 赖世波陈建忠
Owner 厦门三顶新材料科技有限公司