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Repair method of LGA device

A device and component technology, applied in the field of rework of LGA devices, can solve problems such as component damage, and achieve the effects of improving the success rate of rework, reducing production costs and reducing pollution

Inactive Publication Date: 2014-11-26
XIAN SANWEI SECURITY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to its process requirements and the characteristics of this device, it is often used repeatedly, and the repair process will easily cause damage to components due to improper operation.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The rework method of a kind of LGA device of the present invention is characterized in that comprising the steps:

[0016] (1) First pre-baked the PCB components to remove moisture, and then supported the PCB board evenly;

[0017] (2) Next, preheat the bottom of the printed board. For a circuit board with a thickness of 812.8 μm to 1574.8 μm, the bottom preheating temperature is 100 ° C to 110 ° C. For circuit boards with a thickness of 3175 μm and higher assembly density, the preheating temperature is 120 ° C ~ 125 ° C;

[0018] (3) During the whole process, it is necessary to ensure that the temperature around the reworked device is less than 150°C, and the maximum temperature of the chip set on the device is less than 225°C;

[0019] (4) Finally, clean the pad and clean the tin from the pad;

[0020] (5) Print solder paste for the circuit board, and then align and mount components.

[0021] A method for repairing an LGA device according to the present invention i...

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PUM

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Abstract

The invention discloses a repair method of an LGA device, and belongs to the field of an electronic process. The method comprises the following steps: first of all, performing predrying on a PCB assembly to removing moisture, and then supporting the PCB in a flat and uniform mode; preheating the bottom of the PCB with a preheating temperature of 120 DEG C to 125 DEG C; enabling the temperature around a repair device to be smaller than 150 DEG C and the highest temperature of a chip arranged on the device to be smaller than 225 EDG C; and cleaning a pad, making tin clean from the pad, printing a solder paste after accurate counterpoint by use of a miniaturized template, and then carrying out LGA counterpoint and mounting by use of the repair device. Through effective process improvements, the repair success rate of the LGA device is substantially improved, thus the repeated utilization rate of a component is improved, pollution caused by waste and old components to environment is reduced, and the production cost of an enterprise is decreased. Besides, the method also has the advantages of simple operation and easy popularization.

Description

technical field [0001] The invention belongs to the field of electronic technology, in particular to a method for repairing LGA devices. Background technique [0002] For micro-sized LGA devices, the soldering height of packaged devices is only 50.8 μm to 76.2 μm, which has the advantage of low installation height, so LGA packaged devices can effectively improve the performance of board-level electronic components against falling and bending. However, due to the requirements of the process and the characteristics of this device, it is often used repeatedly, and the repair process will easily cause damage to the components due to improper operation. Contents of the invention [0003] The present invention aims to provide a method for repairing LGA devices that can solve the above problems. [0004] The repair method of a kind of LGA device of the present invention is characterized in that comprising the steps: [0005] (1) First pre-baked the PCB components to remove mo...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 贾卫东魏军锋
Owner XIAN SANWEI SECURITY TECH