Resin composition for laser processing

A resin composition and laser processing technology, used in thermoplastic polymer dielectrics, printed circuit dielectrics, coatings, etc., can solve the problem of resin composition cracking, coating chemical resistance, and alkali-developable coating. Formability damage , The problems of laser processability and anti-corrosion resin composition are not obtained, and the effect of improving laser processability and improving laser processability is achieved.

Active Publication Date: 2017-09-22
DAI ICHI KOGYO SEIYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, in the resin composition of Patent Document 2, since the softening temperature of the resin is too high, there is a problem that the resin composition is cracked after laser processing, so that the corrosion resistance, that is, the resistance to plating chemicals, alkali Impairment of developability, plating formability, etc.
Therefore, the reality is that a resin composition having both laser processability and corrosion resistance has not yet been obtained

Method used

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  • Resin composition for laser processing
  • Resin composition for laser processing

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Embodiment

[0054] Although the present invention is described more specifically below by referring to Examples, it should not be construed that the present invention is limited to the following Examples. It should be noted that, hereinafter, the term "parts" means "parts by mass" unless otherwise specified.

Synthetic example

[0056] (Thermoplastic resin A-1)

[0057] In a reaction apparatus equipped with a stirrer, a thermometer, a reflux condenser, a dropping device, and a nitrogen gas introduction tube, nitrogen gas was sealed, and then, 120 parts of methyl isobutyl ketone, 30 parts of isopropanol, 27 parts of acrylic acid were added , 55 parts of styrene, 18 parts of 2-ethylhexyl acrylate, and 2,2'-azobisisobutyronitrile (trade name: V-60, manufactured by Wako Pure Chemical Industries, Ltd. .manufacture). The above-mentioned contents were polymerized at 80° C. for 12 hours with stirring in a nitrogen stream to obtain a thermoplastic resin A-1. The obtained thermoplastic resin A-1 was found to have a weight average molecular weight of 30,000 (measured by GPC, the same below) and a softening temperature of 108° C. (measured by a flow tester, the same below).

[0058] (Thermoplastic resin A-2)

[0059] In a reaction apparatus equipped with a stirrer, a thermometer, a reflux condenser, a dropping...

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Abstract

Provided is a resin composition for laser processing, which improves the laser processability of the resin composition while maintaining the resist performance of the resin after ultraviolet laser processing, and which can be used in It is used, for example, as a resist used when forming circuits in printed wiring boards. The resin composition for laser processing comprises a resin and an ultraviolet absorber, wherein the resin has a carboxyl group and is a thermoplastic resin having a softening point of 70 to 140° C., and the content of the ultraviolet absorber is 1 part based on 100 parts of the thermoplastic resin. to 30 servings.

Description

technical field [0001] The present invention relates to a resin composition for laser processing, and more particularly, the present invention relates to a resin composition for laser processing that can be used as a resist in circuit formation such as a printed wiring board. Background technique [0002] In recent years, electrical equipment such as portable information terminal equipment including mobile phones, computers and their peripheral equipment, various information home appliances, etc. have progressed remarkably, and have developed rapidly in high functionality, size miniaturization, and high speed. [0003] Concomitantly, in circuit boards mounted on the above-mentioned electrical equipment, the densification of circuits is increasingly required. In order to achieve the above-mentioned densification of circuit boards, methods for precisely forming circuits with narrower line widths and line pitches (widths of portions between circuits and circuits adjacent to eac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L101/00C08K5/00C08L33/02
CPCC08K5/005H05K1/0373H05K3/0032H05K3/0076H05K3/184H05K2201/0129C08K5/11C08K5/12C08K5/3475C08K5/523C08L33/064C08L25/14C08F212/08C08F220/06C08F220/1808C08F220/1804C08L33/02C08K5/0016C08K5/521C08J7/04C08J5/18C08J2433/02C08L101/00H05K1/03H05K3/0011
Inventor 村上贤志菊田学
Owner DAI ICHI KOGYO SEIYAKU CO LTD
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