30results about How to "Improve the effect of laser processing" patented technology

The invention provides a laser machining method and device for a wafer. The method comprises that at least two laser beams having different energy distribution respectively execute a hacking process and a grooving process on a predetermined cutting path on the upper surface of the wafer in sequence and are used for forming a groove in the predetermined cutting path on the upper surface of the wafer. The predetermined cutting path on the upper surface of the wafer can be hacked by the laser beams with lower energy, the surface of the predetermined cutting path is roughened to improve a light absorptivity, which is convenient for preparation for a subsequent machining process, and the wafer is prevented from being damaged by stripping of a Low-K material caused by a fact that a Low-K layer on the surface of the wafer is machined by adopting the laser beams with over high energy; and meanwhile, the control precision on the energy of the laser beams in a subsequent machining process is higher, and further a laser machining effect of the upper surface of the wafer is improved.

A resin composition is provided which allows improvement of the ultraviolet laser processability of the resin and can be not only used as an electronic material for an insulating film of a build-up board and the like but also used to form a circuit board whose electrical insulating property does not deteriorate. A multilayer resin film employing the resin composition is provided. A resin composition is provided which contains a thermosetting resin (A), a curing agent (B), a silica (C), an ultraviolet absorber (D), and a solvent (E) and in which: the content of the ultraviolet absorber (D) is from 0.5 to 50 parts by weight per the total amount of the thermosetting resin (A), the curing agent (B), and the ultraviolet absorber (D); and the blending amount of the solvent (E) is from 20 to 500 parts by weight per 100 parts by weight of the total amount of the thermosetting resin (A) and the curing agent (B). A multilayer resin film is provided in which the resin composition is laminated on a base material so as to be in a sheet shape and in which: the sheet-shaped resin composition on the base material is dried; and the content of the solvent is from 0.01 to 5 parts by weight with respect to the entire resin composition.

The invention discloses a laser two-dimensional code ear tag modification material special for breeding stock. The modification material is characterized by comprising the following materials in part by weight: 97 to 99 parts of polyurethane, 1.5 to 2.5 parts of antimony trioxide, 0.01 to 0.03 part of dispersant and 0.05 to 0.09 part of coupling agent. By using the advantages of the thermoplasticpolyurethane such as oil resistance, toughness, abrasion resistance, ageing resistance and the like and adding a photo-oxidation stabilizing auxiliary agent, the weather resistance of the material isimproved, and the problems of ageing, brittleness, breakage, drop and the like under the actions of air, sunlight and oxygen after an ear tag is worn for long time are solved; and by adding a modifying material into the polyurethane, the laser processing performance of a thermoplastic polyurethane elastomer is enhanced, and batch production of laser processing on the thermoplastic polyurethane elastomer material is realized. Tested by the applicant, the drop, breakage or fracture rate of the ear tag made of the modification material does not exceed 2 percent when the ear tag is worn by the breeding stock in three years.

A laminated body of the present invention includes a resin layer in which a core portion composed of a fiber base member having a thickness of 25 μm or less is embedded, the resin layer having two surfaces, and the resin layer through which at least one via-hole is adapted to be formed, and a metal layer bonded to at least one of the two surfaces of the resin layer, and the metal layer having at least one opening portion provided so as to correspond to the via-hole to be formed. Further, a method of manufacturing a substrate of the present invention includes preparing the above laminated body, forming the via-hole so as to pass through the resin layer by irradiating a laser beam onto the resin layer, and removing the metal layer from the resin layer after the via-hole is formed. Further, a substrate of the present invention is manufactured by using the above method. Furthermore, a semiconductor device of the present invention includes the above substrate, and a semiconductor element mounted on the substrate.

The invention discloses a multifunctional laser processing head. The processing head is formed by combining a scanning galvanometer type laser processing head and a spray nozzle type laser processing head into a closed structure through a connecting piece, and when the multifunctional laser processing head works, a laser beam can enter into the scanning galvanometer type laser processing head, be projected to the spray nozzle type laser processing head via the scanning galvanometer type laser processing head and be further converged on the surface of a workpiece on a two-dimensional worktable. The connecting piece can adopt a connecting cylinder and is positioned between a two-dimensional all-trans scanning galvanometer and a convergent lens or positioned between the convergent lens and a coaxial processing spray nozzle. The multifunctional laser processing head disclosed by the invention can overcome the defects of the existing two laser processing heads and fully utilize the advantages of the two laser processing heads. The invention provides the multifunctional laser processing head, which can realize more than two laser processing ways, reduce cost, improve efficiency and further enhance laser processing capability.

The invention relates to checkout equipment applied to a laser head and the corresponding laser head. The equipment comprises a first data detection module used for detecting all parameters of the laser head and related equipment of the laser head, a detection data display module and a control module connected with the first data detection module and the detection data display module, used for converting all parameters detected by the first data detection module into all parameters capable of being displayed by the detection data display module and used for controlling all modules in the laserhead; and the detection data display module is fixed to the exterior of a shell of the laser head, and the first data detection module and the control module are arranged inside the shell of the laser head. By means of the checkout equipment of the structure and the corresponding laser head, the low laser machining process accuracy caused by the fact that detection on laser state parameters is not in time can be effectively avoided.

Provided is a resin composition for laser processing, which improves the laser processability of the resin composition while maintaining the resist performance of the resin after ultraviolet laser processing, and which can be used in It is used, for example, as a resist used when forming circuits in printed wiring boards. The resin composition for laser processing comprises a resin and an ultraviolet absorber, wherein the resin has a carboxyl group and is a thermoplastic resin having a softening point of 70 to 140° C., and the content of the ultraviolet absorber is 1 part based on 100 parts of the thermoplastic resin. to 30 servings.

The invention discloses a preparation process and application of a water-based nano-coating material, a microcrack diagnostic circuit. The invention adopts a self-developed water-based nano-coating material that can be treated by laser metallization, and moves on the surface of the product through a laser beam The surface of the material is thereby activated where a conductive path is to be provided. With the help of laser direct patterning + fine-grained plating method, a conductive path width of 100 microns or less can be obtained. The purpose of the present invention is to remove the influence of other fillers, improve the accuracy of laser direct patterning lines, and make them reach preset mechanical properties. The added laser direct patterning workpiece is pre-sprayed with water-based nano-coating to avoid other fillers from affecting the material processing performance, mechanical properties and later laser processing performance, which greatly improves the quality of the workpiece; the prepared coating has good attachment Strength, salt spray resistance, high temperature and high humidity resistance and thermal shock resistance, the diagnostic circuit has good adhesion and conductivity.

The invention provides a device and method for wafer laser processing. The device comprises a laser unit, a beam expanding and collimating element, a phase-controlled-type silicon-based liquid crystal and a focusing element; the laser unit is used for emitting laser beams; the beam expanding and collimating element is used for beam expanding and collimating of the laser beams to form the parallel light beams; the phase-controlled-type silicon-based liquid crystal is used for conducing energy distribution modulation on the parallel light beams to form random customized multi-light-beam assemblies or conducting shape-correction treatment to form flattop light spots to be emitted to the focusing element; and the focusing element is used for emitting the random customized multi-light-beam assemblies or the flattop light spots to the upper surface of a wafer and removing Low-K materials of the upper surface of the wafer in the pre-set cutting way direction. According to the device and method for wafer laser processing, through the phase-controlled-type silicon-based liquid crystal, energy distribution modulation or shape-correction treatment is conducted on the parallel light beams to improve the work efficiency and accuracy of the processing method and the uniformity of wafer separation, and the device and method for wafer laser processing can be suitable for the requirements of the various flattop light spots.

The invention provides a wafer laser processing method and a device. The method comprises the steps of setting the required preset channel information formed by laser beams on a Low-K layer of the upper surface of a wafer after processing; matching topological pattern distribution required by the laser beams according to the preset channel information; performing beam splitting treatment, shape-correction treatment and focusing treatment to the laser beams according to the topological pattern distribution, and then forming laser spots with the topological pattern distribution for etching the Low-K layer of the upper surface of the wafer and forming the preset channel shape. According to the processing method, the required channel shape formed by the laser beams on the Low-K layer of the upper surface of the wafer after processing can be determined according to the subsequent processing requirements, and the channel information is formed; then, the preset channel information is set through setting elements, and the preset channel information is matched with the optimal topological pattern distribution through a controller, so that the grooves formed on the low-K layer of the surface of the wafer by etching is uniform, a heat-affected zone is small, and the uniformity is high.

The invention discloses a laser two-dimensional code ear tag modification material special for breeding stock. The modification material is characterized by comprising the following materials in part by weight: 97 to 99 parts of polyurethane, 1.5 to 2.5 parts of antimony trioxide, 0.01 to 0.03 part of dispersant and 0.05 to 0.09 part of coupling agent. By using the advantages of the thermoplasticpolyurethane such as oil resistance, toughness, abrasion resistance, ageing resistance and the like and adding a photo-oxidation stabilizing auxiliary agent, the weather resistance of the material isimproved, and the problems of ageing, brittleness, breakage, drop and the like under the actions of air, sunlight and oxygen after an ear tag is worn for long time are solved; and by adding a modifying material into the polyurethane, the laser processing performance of a thermoplastic polyurethane elastomer is enhanced, and batch production of laser processing on the thermoplastic polyurethane elastomer material is realized. Tested by the applicant, the drop, breakage or fracture rate of the ear tag made of the modification material does not exceed 2 percent when the ear tag is worn by the breeding stock in three years.

The invention provides a laser machining method and device for a wafer. The method comprises that at least two laser beams having different energy distribution respectively execute a hacking process and a grooving process on a predetermined cutting path on the upper surface of the wafer in sequence and are used for forming a groove in the predetermined cutting path on the upper surface of the wafer. The predetermined cutting path on the upper surface of the wafer can be hacked by the laser beams with lower energy, the surface of the predetermined cutting path is roughened to improve a light absorptivity, which is convenient for preparation for a subsequent machining process, and the wafer is prevented from being damaged by stripping of a Low-K material caused by a fact that a Low-K layer on the surface of the wafer is machined by adopting the laser beams with over high energy; and meanwhile, the control precision on the energy of the laser beams in a subsequent machining process is higher, and further a laser machining effect of the upper surface of the wafer is improved.

The invention provides a wafer laser-machining method and device. The relative positions of a laser beam and a predetermined cutting path are changed in the direction of the predetermined cutting pathon the upper surface of a wafer, so that a groove is formed in the predetermined cutting path. The method comprises the steps that a flattop light spot is formed on the predetermined cutting path after the laser beam is subjected to shape correction treatment; the flattop light spot is subjected to defocusing treatment, and M-shaped energy distribution with the edge energy greater than the intermediate energy is formed; the flattop light spot with the M-shaped energy distribution is used for etching the predetermined cutting path, so that the groove is formed; and the flattop light spot is subjected to defocusing treatment, energy flattop distribution is formed, and then the flattop light spot with the energy flattop distribution is used for etching the groove again. According to the wafer laser-machining method and device, the wafer can be etched through the flattop light spot with the different energy distribution forms in sequence, the groove bottom of the groove is flatter, the groove wall is steeper, the groove shape quality of the groove is improved, and subsequent machining requirements and the laser machining yield are guaranteed.

To provide a thermosetting electrically conductive paste excellent in laser processability and enabling an electrode having high electrical conductivity to be formed. According to the present invention, the thermosetting electrically conductive paste is provided. The thermosetting electrically conductive paste contains an electrically conductive powder, a thermosetting resin and a curing agent. The electrically conductive powder contains a non-agglomerated electrically conductive powder and an agglomerated electrically conductive powder different from each other in a degree of agglomeration expressed by a ratio (L-D 50 / SEM-D 50) between a number-basis average particle size (SEM-D 50) based on electron microscope observation and a volume-basis average particle size (L-D 50) based on a laser diffraction scattering particle size distribution measurement method. The degree of agglomeration of the non-agglomerated powder is 1.5 or smaller, the degree of agglomeration of the agglomerated powder exceeds 1.5 and is 3 or smaller, the L-D 50 of the agglomerated electrically conductive powder does not exceed L-D 50 of the non-agglomerated electrically conductive powder.

The invention relates to a controllable laser processing device based on wavefront modulation. The controllable laser processing device based on wavefront modulation comprises a laser processing head, an irradiation module and a photoelectric detection analysis module. The irradiation module and the photoelectric detection analysis module are located in different positions of the laser emitting mechanical edge of the laser processing head. Emitting beams of the irradiation module cover the laser processing working area and peripheral areas of the laser processing head, and light fields inside the emitting beam coverage area of the irradiation module are incident on the photoelectric detection analysis module. A light filed wavefront modulation element is arranged on a laser processing light path, so that shaping is achieved by focusing light spots, the laser processing performance is improved, and an optical material analysis technology and a photoelectric position detection technology are combined. Emitting light of the irradiation module irradiates the laser processing area and the peripheral areas of the laser processing head, material composition information and movement position information inside the irradiated areas are detected by the photoelectric detection analysis module, the phenomenon that a non-processing object enters the laser processing area is avoided, and laser of the laser processing device is safe and controllable.

The invention provides a method and device for machining wafers through laser. The method comprises the steps that after beam splitting treatment, shaping treatment and focusing treatment are sequentially carried out on laser beams, laser spots with set pattern distribution are formed; and space positions of the laser spots are adjusted so that grooves can be formed in the upper surfaces of the wafers. According to the method and the device, in the wafer laser machining process, according to the characteristic of the grooves, the laser beams are matched to the optimal set pattern distribution, energy of the scribed laser beams can be distributed more uniformly, the grooves formed in the upper surfaces of the wafers are more uniform, the heat influence area is smaller, uniformity is higher, and then the laser machining effect on the upper surfaces of the wafers is improved.