Resin composition for laser processing

A resin composition and laser processing technology, applied in the direction of thermoplastic polymer dielectric, printed circuit dielectric, coating, etc., can solve the cracking of resin composition, the resistance of plating chemical reagents, and the formation of alkali-developable plating. , The problems of laser processability and corrosion-resistant resin composition are not obtained, and the effect of improving laser processability and improving laser processability is achieved

Active Publication Date: 2014-11-26
DAI ICHI KOGYO SEIYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, in the resin composition of Patent Document 2, since the softening temperature of the resin is too high, there is a problem that the resin composition is cracked after laser processing, so that the corrosion resistance, that is, the resistance to plating chemicals, alkali Impairment of developability, plating formability, etc.
Therefore, the reality is that a resin composition having both laser processability and corrosion resistance has not yet been obtained

Method used

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  • Resin composition for laser processing
  • Resin composition for laser processing

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Embodiment

[0054] Although the present invention is described more specifically below by referring to Examples, it should not be construed that the present invention is limited to the following Examples. It should be noted that, hereinafter, the term "parts" means "parts by mass" unless otherwise specified.

Synthetic example

[0056] (Thermoplastic resin A-1)

[0057] In a reaction apparatus equipped with a stirrer, a thermometer, a reflux condenser, a dropping device, and a nitrogen gas introduction tube, nitrogen gas was sealed, and then, 120 parts of methyl isobutyl ketone, 30 parts of isopropanol, 27 parts of acrylic acid were added , 55 parts of styrene, 18 parts of 2-ethylhexyl acrylate, and 2,2'-azobisisobutyronitrile (trade name: V-60, manufactured by Wako Pure Chemical Industries, Ltd. .manufacture). The above-mentioned contents were polymerized at 80° C. for 12 hours with stirring in a nitrogen stream to obtain a thermoplastic resin A-1. The obtained thermoplastic resin A-1 was found to have a weight average molecular weight of 30,000 (measured by GPC, the same below) and a softening temperature of 108° C. (measured by a flow tester, the same below).

[0058] (Thermoplastic resin A-2)

[0059] In a reaction apparatus equipped with a stirrer, a thermometer, a reflux condenser, a dropping...

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Abstract

Provided is a resin composition for laser processing, in which laser workability can be improved while post-ultraviolet laser processing resist properties of resin are maintained, and which can be used as a resist that is employed when forming circuits in printed circuit boards, for example. The resin composition for laser processing contains resin and an ultraviolet light absorbing agent, wherein the resin has a carboxyl group and is a thermoplastic resin with a softening point of 70-140°C, and the ultraviolet light absorbing agent content of the resin is 1-30 parts per 100 parts of thermoplastic resin.

Description

technical field [0001] The present invention relates to a resin composition for laser processing, and more particularly, the present invention relates to a resin composition for laser processing that can be used as a resist in circuit formation such as a printed wiring board. Background technique [0002] In recent years, electrical equipment such as portable information terminal equipment including mobile phones, computers and their peripheral equipment, various information home appliances, etc. have progressed remarkably, and have developed rapidly in high functionality, size miniaturization, and high speed. [0003] Concomitantly, in circuit boards mounted on the above-mentioned electrical equipment, the densification of circuits is increasingly required. In order to achieve the above-mentioned densification of circuit boards, methods for precisely forming circuits with narrower line widths and line pitches (widths of portions between circuits and circuits adjacent to eac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08K5/00C08L33/02
CPCC08L101/00C08L33/02C08K5/005H05K1/0373H05K3/0032H05K3/0076H05K3/184H05K2201/0129C08K5/11C08K5/12C08K5/3475C08K5/523C08L33/064C08L25/14C08F212/08C08F220/06C08F220/1808C08F220/1804C08K5/0016C08K5/521C08J7/04C08J5/18C08J2433/02H05K1/03H05K3/0011
Inventor 村上贤志菊田学
Owner DAI ICHI KOGYO SEIYAKU CO LTD
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