Laser plane machining device

A plane processing and equipment technology, applied in the field of laser plane processing equipment, can solve the problems that the superiority of laser processing cannot be reflected, it is difficult to process flatness and roughness, and the cost cannot be effectively controlled, so as to ensure the laser processing effect and reduce the cost. Processing cost, wide range of effects

Pending Publication Date: 2020-02-07
苏州高意激光科技有限公司
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Recently, laser ablation has been used, but the effect of laser plane processing (or partly called laser grinding) is not ideal. Most of them can only process workpieces with a flat initial surface. If the initial surface is uneven, it is difficult to process. To the flatness and roughness close to grinding
If the workpiece is flattened first, then laser-polished, and finally ground with a grinder, the superiority of laser processing will not be reflected, and the cost will not be effectively controlled.

Method used

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  • Laser plane machining device
  • Laser plane machining device

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Embodiment Construction

[0034] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0035] Referring to the accompanying drawings, a laser plane processing equipment includes: a support assembly, a clamping block 2, a laser head 3, a monitoring assembly and a measuring assembly.

[0036] The function of the support assembly is mainly to fix and support the workpiece 7 . The support assembly includes a base 11 , an XY translation stage 12 , a base 13 , and a positioning block 14 . The XY translation stage 12 is arranged on the base 11 , and the base 13 is arranged on the XY translation stage 12 . The movement of the base 13 in the horizontal direction is realized by the XY translation stage 12, and the XY translation stage 12 in...

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Abstract

The invention discloses a laser plane machining device. The device comprises a supporting assembly, a clamping block, a laser head, a monitoring assembly and a measuring assembly, wherein a workpieceis placed on the supporting assembly, and the clamping block is arranged above the supporting assembly; the laser head is arranged on the clamping block and is located above the workpiece, and an angle is arranged between the laser head and a to-be-machined surface of the workpiece; the monitoring assembly comprises a camera, the camera is arranged on the clamping block, the camera is aligned withthe workpiece, and the central axis of the camera is perpendicular to the to-be-machined surface of the workpiece; and the measuring assembly comprises an optical distance measuring instrument, the optical distance measuring instrument is arranged on the clamping block, and the optical distance measuring instrument is aligned with the workpiece. According to the device, by means of the mode, thelaser can be used for machining the workpiece in the direction inclined to the to-be-machined surface of the workpiece, the device can be suitable for a workpiece with an uneven initial surface, the application range of the device is wide, and the effect of laser machining is improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser plane processing equipment. Background technique [0002] Most of the traditional surface machining technologies are milling or grinding using tools with higher hardness than the workpiece to be processed. There are also surface machining using electric spark discharge, that is, milling cutter milling, grinding wheel, electric spark discharge or micro powder grinding. class method. [0003] Face milling with milling cutters cannot machine superhard materials such as diamond and cubic boron nitride, because no milling cutter grade is harder than these materials. [0004] The use of electric spark grinding used to be a popular method, and now there are some products of superhard materials that continue to be processed by this process. However, spark discharge will damage the internal structure of the material, resulting in a decline in the final quality of the pr...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/70
CPCB23K26/00B23K26/702
Inventor 吴喜泉托比·如康玉刚
Owner 苏州高意激光科技有限公司
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