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Conductive fine particles, method for manufacturing same, conductive resin composition, conductive sheet, and electromagnetic shielding sheet

A technology of conductive resin and manufacturing method, which is applied in the field of conductive sheets, electromagnetic wave shielding sheets, and conductive resin compositions, which can solve problems such as inability to maintain conductivity, achieve excellent conductive properties, and reduce costs

Active Publication Date: 2014-11-26
TOYO INK SC HOLD CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to reduce the cost of electronic equipment, it is urgent to reduce the use ratio of conductive fillers. However, if the use ratio of conductive fillers is reduced, the desired conductivity cannot be maintained.

Method used

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  • Conductive fine particles, method for manufacturing same, conductive resin composition, conductive sheet, and electromagnetic shielding sheet
  • Conductive fine particles, method for manufacturing same, conductive resin composition, conductive sheet, and electromagnetic shielding sheet
  • Conductive fine particles, method for manufacturing same, conductive resin composition, conductive sheet, and electromagnetic shielding sheet

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0062] First, dendritic silver-plated copper powder in which silver plating was applied to copper powder was prepared. The silver-plated copper powder and the solid medium are put into a closed container, and the solid medium is allowed to collide with the silver-plated copper powder in the closed container, so that the dendritic silver-plated copper powder is deformed into the conductive particles of the present invention. By colliding the solid medium with the branches of the silver-plated copper powder, the conductive particles having the scaly leaves or branched leaves of the present invention can be obtained. Among them, at the timing of adding the silver-plated copper powder, additives such as heavy metal inactivator and / or resin used in the conductive resin composition may also be added. By adding the conductive resin composition and additives, the conductive resin composition described later can be produced simultaneously with the production of conductive fine particle...

manufacture example 2

[0064]First, prepare dendritic copper powder. Put the copper powder and solid medium into an airtight container, let the solid medium collide with the copper powder in the airtight container, and transform the dendritic copper powder into the shape of the conductive particles of the present invention. Copper powder with scaly leaves or branched leaves can be obtained by letting the solid medium touch the branch part of the copper powder. Next, by coating silver on the obtained copper powder having scales or branches by plating, the conductive fine particles having scales or branches of the present invention can be obtained.

[0065] (conductive resin composition)

[0066] Next, the conductive resin composition of the present invention will be described. The conductive resin composition of the present invention includes the conductive fine particles and resin of the present invention. On the other hand, the conductive resin composition of the present invention may contain co...

Embodiment

[0096] Hereinafter, the present invention will be described in more detail with examples, but the present invention is not limited thereto. In addition, the following "parts" and "%" are values ​​based on "parts by weight" and "% by weight", respectively.

[0097] Table 1 shows the non-leaf-shaped conductive fine particles used as raw materials. Dendritic silver-plated copper powders of conductive fine particles 1 to 7 were manufactured by Mitsui Metal Mining Co., Ltd. In addition, the dendritic copper powder of the conductive fine particles 8, the spherical silver-plated copper powder of the conductive fine particles 9, and the scaly silver powder of the conductive fine particles 11 were those manufactured by Fukuda Metal Foil Powder Industry Co., Ltd. In addition, as the scaly silver-plated copper powder of the electroconductive fine particle 10, the product manufactured by Mitsui Metal Mining Co., Ltd. was used. Here, the average particle diameter (D50) of the conductive ...

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Abstract

Provided are conductive fine particles that are capable of reducing costs, have excellent conductive properties, and can be made thin when, for example, a composition mixed with resin is formed into a sheet shape. The conductive fine particles according to the present invention are formed of a nuclear body comprising a conductive material, and a covering layer comprising another conductive material that covers the nuclear body, whereof at least a portion forms the outermost layer. A circle diameter coefficient obtained from the following formula (1) is between 0.15 and 0.4, and at least one of a cut that has an outer edge shape and a branching leaf is provided in a plural number. [Formula 1] circle diameter coefficient = (area×4pi) / (perimeter)2sssFormula (1)

Description

technical field [0001] The present invention relates to conductive fine particles and a method for producing the same. In addition, it also relates to a conductive resin composition containing the aforementioned conductive fine particles. In addition, it also relates to a conductive sheet and an electromagnetic shielding sheet provided with a conductive layer formed of the aforementioned conductive resin composition. Background technique [0002] Printed circuit boards are becoming thinner along with the miniaturization of electronic devices such as mobile phones and digital cameras, and flexible printed circuit boards are often used. A conductive sheet, an electromagnetic wave shielding sheet, and the like (hereinafter also referred to as "conductive sheet, etc.") are generally used for printed circuit boards. Conductive sheets and the like are required to have excellent conductive characteristics including stability over time, so the characteristics of the conductive fil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/00B22F1/00B22F1/02B22F9/04H01B1/22H01B13/00H05K9/00B22F1/102B22F1/17
CPCB22F1/025H05K9/0083B22F1/0062H01B1/22H01B1/02B22F1/102B22F1/17
Inventor 早坂努森祥太西山祐司松户和规高桥政胜
Owner TOYO INK SC HOLD CO LTD
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