Organic light-emitting device and manufacturing method thereof

Abstract

The invention discloses an organic light-emitting device. The organic light-emitting device comprises a transparent substrate including a first face and a second face opposite to the first face, multiple light-emitting units located on the first face of the transparent substrate, a thin film transistor arranged on the transparent substrate and located between the first face and the light-emitting units, a pixel definition layer arranged between any two adjacent light-emitting units, a packaging cover plate sealing the thin film transistor, the light-emitting units and the pixel definition layer between the packaging cover plate and the transparent substrate, a partition part arranged on the pixel definition layer, sealed between the packaging cover plate and the transparent substrate and used for supporting the packaging cover plate and a metal reflection layer arranged on the second face. The invention further provides a manufacturing method of the organic light-emitting device. The metal reflection layer is arranged on the back face of the transparent substrate to improve the light emergence efficiency of an OLED device and strengthen the brightness of an OLED display module and meanwhile facilitates heat loss of a display module, and reduction of the light-emitting efficiency of the device and shortening of the service life of the device due to heat accumulation are avoided.

Description

technical field [0001] The invention relates to the technical field of OLED displays, in particular to an organic light-emitting device and a preparation method thereof. Background technique [0002] As a new generation of display devices, organic electroluminescent devices (OLEDs) have many advantages, and have broad application prospects in mobile phones, digital cameras, vehicle displays, notebook computers and military fields. Such as figure 1 As shown, the OLED display generally adopts a glass substrate 1, and a transistor device 2, a light-emitting unit 3, and a package cover 4 are sequentially formed on the glass substrate 1, wherein the transistor device 2 of the driving backplane of the OLED display adopts a translucent Therefore, the following situation will inevitably occur. After testing, about 18%-20% of the light will be transmitted to the back of the glass substrate 1 through the light-transmitting material due to the reflection of each interface, and then be...

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Problems solved by technology

[0003] In addition, because sometimes OLED display modules have long-term display requirements in a certain area, heat accumulation will inevitably occur, which will reduce the efficiency and life of some devices

For the uniformity of heat, at present, the purpose of uniform heat dissipation is generally achieved by attaching a single-piece heat sink, but this preparation method is for attaching modules one by one, which requires more labor, and the single-piece heat sink higher cost

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