Curable epoxy resin composition

A technology of epoxy resin and epoxy compound, which is applied in the direction of electrical solid devices, semiconductor/solid device parts, electrical components, etc., can solve the problems of cracks in packaging materials and packaging materials, and achieve the effect of excellent resistance to moisture absorption and reflow

Inactive Publication Date: 2014-12-10
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under such circumstances, in the conventional optical semiconductor device, the heat treatment in the reflow process has caused the following deterioration problems: the encapsulation material is peeled off from the lead frame of the optical semiconductor device or the encapsulation material is cracked.

Method used

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  • Curable epoxy resin composition
  • Curable epoxy resin composition
  • Curable epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0170] (manufacture of rubber particles)

[0171] 500 g of ion-exchanged water and 0.68 g of sodium dioctyl sulfosuccinate were placed in a 1 L polymerization vessel equipped with a reflux condenser, and the temperature was raised to 80° C. while stirring under a nitrogen stream. A monomer mixture consisting of 9.5 g of butyl acrylate, 2.57 g of styrene, and 0.39 g of divinylbenzene corresponding to about 5% by weight of the amount required to form the core portion was added together, and stirred for 20 minutes to emulsify Then, 9.5 mg of potassium peroxodisulfate was added, and the mixture was stirred for 1 hour to conduct initial seed polymerization. Next, 180.5 mg of potassium peroxodisulfate was added, followed by stirring for 5 minutes. The remainder (about 95% by weight) of 180.5 g of butyl acrylate, 48.89 g of styrene, A monomer mixture comprising 7.33 g of divinylbenzene was subjected to the second seed polymerization, and then aged for 1 hour to obtain a core portio...

manufacture example 2

[0176] (Manufacture of rubber particle dispersed epoxy compound)

[0177] 10 parts by weight of the rubber particles obtained in Production Example 1 were dispersed in a product name "Celloxide 2021P" (3,4-epoxy ring 70 parts by weight of hexylmethyl (3,4-epoxy) cyclohexane carboxylate, manufactured by Daicel, was vacuum defoamed to obtain a rubber particle-dispersed epoxy compound (viscosity at 25° C.: 724 mPa·s ).

[0178] In addition, the viscosity (viscosity at 25° C.) of the rubber particle-dispersed epoxy compound obtained in Production Example 2 (a product obtained by dispersing 10 parts by weight of rubber particles in 70 parts by weight of Celloxide 2021P) was measured using a digital viscometer. (trade name "DVU-EII type", manufactured by Tokimec Co., Ltd.).

manufacture example 3

[0180] (manufacture of epoxy resin)

[0181] With the compounding ratio (unit: weight part) shown in Table 1, Table 2, trade name "Celloxide 2021P" (alicyclic epoxy compound, manufactured by Daicel Co., Ltd.), monoallyl diglycidyl isocyanurate (MA-DGIC, Shikoku Chemical Industry Co., Ltd.), trade name "X-40-2678" (siloxane derivative having two epoxy groups in the molecule, manufactured by Shin-Etsu Chemical Co., Ltd.), trade name " X-40-2720" (siloxane derivatives having three epoxy groups in the molecule, manufactured by Shin-Etsu Chemical Co., Ltd.), trade name "X-40-2670" (siloxane derivatives having four epoxy groups in the molecule Silicone derivative, manufactured by Shin-Etsu Chemical Co., Ltd.), trade name "YD-128" (bisphenol A type epoxy resin, manufactured by Nippon Steel Chemical Co., Ltd.), dispersed rubber obtained in Production Example 2 The epoxy resin of the particles was uniformly mixed using a rotation and revolution type stirring device (manufactured by Co...

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Abstract

The purpose of the present invention is to provide a curable epoxy resin composition which is capable of forming a cured product that has high heat resistance, high light resistance, high thermal shock resistance, and especially excellent reflow resistance after moisture absorption. A curable epoxy resin composition of the present invention is characterized by containing (A) an alicyclic epoxy compound, (B) a monoallyl diglycidyl isocyanurate compound represented by formula (1), (C) a curing agent and (D) a curing accelerator. The curable epoxy resin composition is also characterized in that: a methyl norbornane-2,3-dicarboxylic acid anhydride is contained as an essential component of the curing agent (C); and the content of succinic acid anhydride in the whole curing agent (C) is 0.4% by weight or less. (In the formula, R1 and R2 may be the same as or different from each other, and each represents a hydrogen atom or an alkyl group having 1-8 carbon atoms.)

Description

technical field [0001] The present invention relates to a curable epoxy resin composition, a cured product obtained by curing the curable epoxy resin composition, and an optical semiconductor element encapsulated with the cured product of the curable epoxy resin composition. semiconductor device. Background technique [0002] In recent years, the increase in output of optical semiconductor devices has progressed, and in such optical semiconductor devices, high heat resistance and light resistance are required for the resin (encapsulating material) covering the optical semiconductor element. Conventionally, as an encapsulant for forming a highly heat-resistant encapsulant, a composition containing, for example, monoallyl diglycidyl isocyanurate and a bisphenol A epoxy resin is known (see Patent Document 1). However, when the above-mentioned composition is used as an encapsulant for high-output blue and white optical semiconductors, the light and heat emitted from the optical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/26C08G59/24C08G59/42C08L67/00H01L23/29H01L23/31
CPCC08G59/26H01L23/296C08G59/42C08G59/226H01L2224/48091C08L63/00C08G59/24H01L23/293H01L2224/48247C08G59/686H01L2924/00014C08G59/38C08G59/4215C08L2203/206H01L33/56
Inventor 铃木弘世
Owner DAICEL CHEM IND LTD
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