Hot melt adhesives for electrical devices
A technology of hot-melt adhesives and electrical devices, applied in the direction of adhesive types, grafted polymer adhesives, adhesives, etc., can solve problems such as difficult high-level requirements, and achieve excellent adhesion, adhesion Excellent adhesion and improved adhesion
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Examples
Embodiment
[0098] The present invention will be described in detail through examples and comparative examples, but these examples are for illustrative purposes only and are not intended to be construed restrictively.
[0099] The components used to prepare the hot melt adhesive for electrical devices are shown below.
[0100] (A) Olefin modified polymer
[0101] (A1) Silane-modified amorphous poly-α-olefin (ethylene-propylene-butene copolymer) (glass transition temperature: -29°C, softening point: 100°C, melt viscosity at 190°C: 12,000 mPa·s, VESTOPLAST EP2412 (trade name) manufactured by Evonik Degussa Corporation)
[0102] (A2) Silane-modified polyisobutylene (melt viscosity at 190° C.: 170 mPa·s, EPION EP100S (trade name) manufactured by Kaneka Corporation)
[0103] (A'3) Ethylene-vinyl acetate copolymer (vinyl acetate content: 28% by weight, melt viscosity at 190°C: 23,000 mPa·s, ULTRASEN722 (trade name) manufactured by TOSOH CORPORATION)
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Abstract
Description
Claims
Application Information
- IPC
- C09J151/06; H01M2/08; H01M50/193
- CPC
- C09J151/06; C09J2203/33; C08K5/01; C08L23/0815; C08L23/10; C08L91/06; C09J123/26; Y02E60/10
- Inventors
- 东松逸朗; 松田健二



