Method for making printed circuit boards by coreless board technology

Abstract

The invention provides a method for manufacturing a printed circuit board or an integrated circuit package substrate through the coreless board process. The method comprises the following steps that a, two pieces of copper foil are pasted to the two faces of a carrier board through adhesive films, so that a processing board is obtained; b, insulating medium materials and conducting materials are laminated on the processing board, so that a new processing board is obtained; c, the processing board is subjected to pattern transfer, so that conductor circuit patterns are formed on the surfaces of the processing board; d, insulating medium materials and conducting materials are laminated on the surfaces of the conductor patterns of the processing board to form insulating medium layers and conducting layers; e, the step c and the step d are repeated, so a plurality of layers of prepreg boards are formed on the two sides of the carrier board; f, the carrier board is separated from the prepreg boards from the adhesive films, so that two coreless boards formed by laminating prepregs completely are formed; g, the prepreg boards are processed through the lamination process, the drilling process, the electroplating process and the pattern transfer process. By means of the method, special equipment or special processing tools are not needed, the cost and production risks can be reduced substantially, and the production efficiency and the yield can be improved.

Description

technical field [0001] The invention relates to a printed circuit board or a semiconductor integrated circuit manufacturing technology, in particular to a coreless board processing method in the manufacturing process of a printed circuit board or a semiconductor integrated circuit packaging substrate. The method is especially suitable for the processing and manufacture of an ultra-thin core board, or a printed circuit board interconnected at any layer or a semiconductor integrated circuit packaging substrate. Background technique [0002] With the vigorous development of the electronic industry, electronic products have entered the stage of functional and intelligent research and development. In order to meet the development needs of high integration, miniaturization and miniaturization of electronic products, printed circuit boards or semiconductor integrated circuit packaging substrates are used in Under the premise of satisfying the good electrical and thermal performance...

AI Technical Summary

Problems solved by technology

For example, frames are used on the vertical production line, and guide plates are used for auxiliary processing on the horizontal production line to avoid problems such as bending, breakage, and board jamming. However, these methods have disadvantages such as complicated operation, low efficiency and yield.

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