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A kind of epoxy resin composition and preparation method thereof for high-voltage electrical insulation

An epoxy resin, high-voltage power technology, applied in the direction of organic insulators, plastic/resin/wax insulators, etc., can solve the problems of self-lubricating properties of insulating joints, unfavorable high voltage, etc., to improve shrinkage rate and improve electrical insulation performance. , the effect of good heat resistance

Active Publication Date: 2017-01-04
STATE GRID CORP OF CHINA +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned epoxy resin combination group uses alcohols and amine curing agents, and water or small molecular compounds are precipitated during the reaction process, which is not conducive to maintaining high voltage.
At the same time, the current mega-volt pot insulators mostly use amine curing agents and alumina fillers, which cannot meet the self-lubricating performance requirements of insulating joints

Method used

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  • A kind of epoxy resin composition and preparation method thereof for high-voltage electrical insulation

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The epoxy resin composition used for high-voltage electrical insulation in this embodiment consists of the following components in parts by weight: 100 parts of bisphenol A epoxy resin, 60 parts of methyltetrahydrophthalic anhydride, disulfide 60 parts of molybdenum powder, 0.1 part of 2,4,6-tris(dimethylaminomethyl)phenol.

[0023] The preparation method of the epoxy resin composition used for high voltage electrical insulation in this embodiment comprises the following steps:

[0024] (1) Accurately take each component according to the parts by weight, heat molybdenum disulfide powder at 125°C for 6 hours for later use, bisphenol A epoxy resin for 8 hours at 125°C for later use, methyltetrahydrophthalate Formic anhydride is heated and melted at 115°C to become a liquid for later use;

[0025] (2) Heat the bisphenol A resin in step (1) to 135°C, add molybdenum disulfide powder, stir for 20 minutes, then continuously vacuumize to 200Pa for 2 hours, and control the temp...

Embodiment 2

[0028] The epoxy resin composition used for high-voltage electrical insulation in this embodiment consists of the following components in parts by weight: 100 parts of bisphenol A epoxy resin, 65 parts of methyltetrahydrophthalic anhydride, disulfide 70 parts of molybdenum powder, 0.05 parts of 2,4,6-tris(dimethylaminomethyl)phenol.

[0029] The preparation method of the epoxy resin composition used for high voltage electrical insulation in this embodiment comprises the following steps:

[0030] (1) Accurately take each component according to the number of parts by weight, heat molybdenum disulfide powder at 130°C for 5 hours for later use, bisphenol A epoxy resin for 5 hours at 130°C for later use, methyltetrahydrophthalate Formic anhydride is heated and melted at 120°C to become a liquid for later use;

[0031] (2) Heat the bisphenol A resin in step (1) to 140°C, add molybdenum disulfide powder, stir for 15 minutes, then continuously vacuumize to 200Pa for 5 hours, and cont...

Embodiment 3

[0034] The epoxy resin composition used for high-voltage electrical insulation in this embodiment consists of the following components in parts by weight: 100 parts of bisphenol A epoxy resin, 70 parts of methyltetrahydrophthalic anhydride, disulfide 80 parts of molybdenum powder, 0.08 parts of 2,4,6-tris(dimethylaminomethyl)phenol.

[0035] The preparation method of the epoxy resin composition used for high voltage electrical insulation in this embodiment comprises the following steps:

[0036] (1) Accurately take each component according to the number of parts by weight, heat molybdenum disulfide powder at 135°C for 4 hours for later use, bisphenol A epoxy resin for 3 hours at 135°C for later use, methyltetrahydrophthalate Formic anhydride is heated and melted at 125°C to become a liquid for later use;

[0037] (2) Heat the bisphenol A resin in step (1) to 145°C, add molybdenum disulfide powder, stir for 15 minutes, then continuously vacuumize to 200Pa for 8 hours, and cont...

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Abstract

The invention discloses an epoxy resin composition for high voltage electrical insulation, and a preparation method thereof, and belongs to the technical field of electric appliance insulation. The epoxy resin composition comprises, by weight, 100 parts of bisphenol A epoxy resin, 60-70 parts of an anhydride curing agent, 60-80 parts of molybdenum disulfide powder and 0.05-0.1 parts of an accelerator, wherein the bisphenol A epoxy resin is used as a matrix and is the basis of the electrical performance and mechanical performances of a system, the molybdenum disulfide powder is used as a filler and can improve the shrinkage rate, the thermal conductivity, the thermal expansion coefficient and the wear resistance of the system, and the curing agent reacts with the bisphenol A epoxy resin to form a thermosetting compound. Insulation joints for 1100kV closed combination, made by adopting the above formula, have black appearance, have no cracking or impurities, and accord with appearance quality standards; and the glass transition temperature is not less than 104DEG C, the tensile strength is not more than 40MPa, the bending strength is not less than 60MPa, the impact strength is not less than 10KJ / m<2>, the power frequency withstand voltage is not less than 5kV / mm, and technical parameters meet or exceed design requirements.

Description

technical field [0001] The invention specifically relates to an epoxy resin composition used for high-voltage electric insulation and a preparation method of the epoxy resin composition, belonging to the technical field of electrical insulation. Background technique [0002] Epoxy resin is an important class of thermosetting resins, which have excellent wear resistance and electrical insulation properties, low shrinkage, easy processing and low cost, and have been widely used in the field of electrical insulation. The molecular structure of epoxy resin contains two or more epoxy groups, which can react with curing agents (anhydrides, amines, etc.) to form cross-linked cured products. Currently, commercially available epoxy resin compositions generally include epoxy resins, pre-reaction hardeners and curing agents. For example, an epoxy resin composition disclosed in Chinese Patent (Application No.: 200880131257.3) includes epoxy resin, hardener, mineral filler and other add...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02H01B3/40C08G59/42C08K3/30C08K5/17
Inventor 侯亚峰杨保利郝留成王玉杰何金林侯国良
Owner STATE GRID CORP OF CHINA
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