A fixing device used for silicon corrsion

A technology of fixing devices and snapping devices, applied in the field of computers, can solve problems such as low pass rate, poor quality of silicon wafers, large contact area between silicon chips and accommodating devices, etc., and achieve the goal of improving quality and pass rate, and reducing contact area Effect

Active Publication Date: 2015-01-21
FOUNDER MICROELECTRONICS INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present application provides a fixing device applied to silicon etching, which is used to solve the problem that the contact area between the silicon wafer and the housing device is relatively large in the prior art when the silicon etching pro

Method used

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  • A fixing device used for silicon corrsion
  • A fixing device used for silicon corrsion
  • A fixing device used for silicon corrsion

Examples

Experimental program
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Example Embodiment

[0045] Example one

[0046] See figure 1 The embodiment of the present application provides a fixing device applied to silicon etching. The fixing device 10 includes a first frame 20 and a second frame 30, and a connecting device for connecting the first frame 20 and the second frame 30 , The connecting device includes a first connecting piece 40 and a second connecting piece 41.

[0047] Wherein, the first clamping device 50 is fixedly connected to the inner side of the first film frame 20, the second clamping device 60 is fixedly connected to the inner side of the second film frame 30, and the lower end of the first clamping device 50 has a first concave portion 51, The lower end of the second engaging device 60 has a second concave portion 61.

[0048] See figure 2 , The first frame 20 includes a first frame 21, a first bottom column 22 fixed at the lower end of the first frame 21, and a first upper column 23 fixed at the upper part of the first frame 21. The middle part of the ...

Example Embodiment

[0062] Example two

[0063] The second embodiment of the present application is different from the first embodiment in that the structures of the first engaging device and the second engaging device are different. For the sake of brevity of the description, the similarities between the second embodiment of the present application and the first embodiment can be referred to the first embodiment, which will not be repeated here. The following describes in detail the differences between the second embodiment of the application and the first embodiment, including:

[0064] The first engaging device 50 includes N clips, where N is an integer not less than 2, that is, the first engaging device includes at least a first clip and a second clip. See Picture 9 Take the first clamping device 50 only including the first clip 52 and the second clip 53 as an example. The first clip 52 includes a first connecting piece 54 and a fifth connecting piece 58. The fifth connecting piece 58 is fixed ...

Example Embodiment

[0073] Example three

[0074] The difference between the third embodiment of the present application and the first embodiment is that a first supporting device is fixedly connected to the outer side of the first film rack, and a second supporting device is fixedly connected to the outer side of the second film rack, so that the fixing device It remains stable during silicon wafer etching. For the sake of brevity of the description, the similarities between the third embodiment of the present application and the first embodiment can be referred to the first embodiment, which will not be repeated here. The following describes in detail the differences between the third embodiment of the application and the first embodiment, including:

[0075] The first supporting device includes N clips, where N is an integer not less than 2, that is, the first supporting device includes at least a fifth clip and a sixth clip. See Picture 11 Take the first supporting device including the fifth cl...

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Abstract

The present invention discloses a fixing device used for silicon corrosion, the fixing device contains a first rack , a second rack and a connecting device for connecting the first rack with the second rack. A first clamping device is fixedly connected with the inner side of the first rack and a second clamping device is fixedly connected with the inner side of the second rack. The bottom end of the first clamping device has a first inner concave part and the bottom end of the second clamping device has a second inner concave part as well. When being clamped to the first clamping device and the second clamping device, a silicon slice is accommodated by the accommodation space comprising the first clamping device and the second clamping device, thereby reducing the contacting area of the silicon slice and the clamping device and the clamping device.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a fixing device applied to silicon corrosion. Background technique [0002] With the development of semiconductor technology, the existing multi-semiconductor products will be subjected to the backside thinning process due to the heat dissipation of the chip and the packaging volume requirements. The thickness after thinning varies from 100 to 400 microns according to customer requirements. The existing backside thinning process generally uses a grinding wheel thinner to thin the silicon wafer. In this way, a large amount of silicon shavings will remain on the surface of the silicon wafer, and there is a serious loss layer, so that the silicon wafer will be damaged due to the damaged layer. However, if there is serious warpage and internal stress, it is necessary to use a silicon etching process to repair the surface of the wafer through silicon etching to eliminate internal st...

Claims

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Application Information

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IPC IPC(8): H01L21/683
CPCH01L21/683H01L21/687
Inventor 张忠华
Owner FOUNDER MICROELECTRONICS INT
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