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Wave-absorbing material, wave-absorbing substrate and preparation method

A wave-absorbing material and substrate technology, applied in the field of wave-absorbing materials, can solve problems such as low mechanical strength of wave-absorbing materials and complex thickness of wave-absorbing layers

Active Publication Date: 2018-01-30
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The mechanical strength of the wave-absorbing material prepared by this method is low, and its use in many special fields has great limitations; and changing the thickness of the wave-absorbing layer is also more complicated

Method used

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  • Wave-absorbing material, wave-absorbing substrate and preparation method
  • Wave-absorbing material, wave-absorbing substrate and preparation method
  • Wave-absorbing material, wave-absorbing substrate and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] The wave-absorbing substrate is obtained by impregnating the para-aramid paper used as a reinforcing material sheet into the resin-based wave-absorbing material, and then at least heating the para-aramid paper, such as a baking process. Among them, the resin-based absorbing material is configured according to the following ratio:

[0069]

[0070] Wherein, the ratio of the phenolic hydroxyl equivalent of the phenolic resin to the epoxy equivalent of the epoxy resin is 1:1.

[0071] Preparation method: Stir epoxy resin, phenolic resin, carbonyl iron powder and acetone evenly to make a glue (for example, stir for about 2 hours); use Haotian Longbang's 0.05mm para-aramid paper L344 as a reinforcing material sheet, and The reinforcing material sheet is immersed in the glue solution for more than 1 second, and then baked in an oven at 100-200°C for 1-20 minutes to obtain a semi-cured absorbent with a thickness of more than 0.1 mm and a curing degree of 30% to 40%. Wave m...

Embodiment 2

[0074] The wave-absorbing substrate is obtained by impregnating the para-aramid paper used as a reinforcing material sheet into the resin-based wave-absorbing material, and then at least heating the para-aramid paper, such as a baking process. Among them, the resin-based absorbing material is configured according to the following ratio:

[0075]

[0076] Wherein, the ratio of the phenolic hydroxyl equivalent of the phenolic resin to the epoxy equivalent of the epoxy resin is 1:1.

[0077] Preparation method: Stir epoxy resin, phenolic resin, carbonyl iron powder and acetone evenly, add dimethylimidazole and stir to make a glue (for example, 2 hours), and use Haotian Longbang's 0.05mm para-aramid fiber Paper L344 is used as a reinforcing material sheet, dipping the reinforcing material sheet into the glue solution, and then baking in an oven at 100-200°C for 1-20 minutes to obtain a semi Cured sheet of absorbing material. Then, use a high-temperature vacuum press to press ...

Embodiment 3

[0080] The wave-absorbing substrate is obtained by impregnating the para-aramid paper used as a reinforcing material sheet into the resin-based wave-absorbing material, and then at least heating the para-aramid paper, such as a baking process. Among them, the resin-based absorbing material is configured according to the following ratio:

[0081]

[0082] The ratio of the phenolic hydroxyl equivalent of the phenolic resin to the epoxy equivalent of the epoxy resin is 1:1.

[0083] Preparation method: Stir epoxy resin, phenolic resin, carbonyl iron powder and acetone evenly, add dimethylimidazole and stir to make a glue (for example, 2 hours), and use Haotian Longbang's 0.05mm para-aramid fiber Paper L344 is used as a reinforcing material sheet, dipping the reinforcing material sheet into the glue solution, and then baking in an oven at 100-200°C for 1-20 minutes to obtain a semi Cured sheet of absorbing material. Then, use a high-temperature vacuum press to press 20 sheets...

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Abstract

The invention discloses a wave-absorbing material with better wave-absorbing performance, which comprises, in parts by weight: 100 parts of epoxy resin; 23-26 parts of curing agent, wherein the curing agent is phenolic resin or acid anhydride resin , amine resin or their mixture; 200-400 parts of carbonyl iron powder; 40-100 parts of organic solvent, the organic solvent is acetone, butanone, propanol methyl ether or their mixture. The invention also discloses a preparation method of the wave-absorbing material substrate.

Description

technical field [0001] The invention relates to the technical field of wave-absorbing materials, and more specifically, to an epoxy resin composite wave-absorbing material, a wave-absorbing substrate and a preparation method thereof. Background technique [0002] Absorbing material is an important functional composite material, which was first used in military, which can reduce the radar cross section of military targets. With the development of science and technology, electronic components are increasingly integrated, miniaturized and high-frequency, and microwave-absorbing materials are more and more widely used in civil fields, such as microwave anechoic chamber materials, micro-attenuator components and microwave molding processing technology, etc. . How to integrate absorbing materials into existing composite materials and structures has become a major challenge in material preparation. [0003] Absorbing materials are usually composite materials made by mixing matrix...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08K3/18C08K5/3445C09K3/00B32B27/04B32B27/38B32B3/24B32B37/06B32B38/04
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH