Patch pasting method and device for patch head of patch pasting machine

A technology of placement head and placement machine, which is applied in the direction of assembling printed circuits with electrical components, electrical components, and printed circuit manufacturing, etc., can solve the problems of invariable distance adjustment and inability to adjust, and achieve the effect of reliable adjustment.

Inactive Publication Date: 2015-02-11
CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY
View PDF5 Cites 30 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the distance adjustment of the existing patch heads is not variable, and even all of them are fixed positions. Therefore, when it is necessary to adjust the amplitude of the patch head, it cannot be adjusted, so it is necessary to further improve it.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Patch pasting method and device for patch head of patch pasting machine
  • Patch pasting method and device for patch head of patch pasting machine
  • Patch pasting method and device for patch head of patch pasting machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] attached Figure 1-8 A technical embodiment of the present invention is given. It can be seen from the accompanying drawings that the present invention relates to a placement head of a placement machine. The placement head is composed of five mutually independent placement head suction nozzle assemblies 4 and a mark camera assembly 1, a placement head mounting backplane assembly 2 and a pneumatic valve. The island seat assembly 3 is combined; among them, the mark camera assembly 1 is fixed on the mount head installation backplane 2 through two connecting plates, and is used for taking pictures and positioning the PCB board during the mount process; the mount head suction nozzle assembly 4, the pneumatic valve The island seat assembly 3 is connected with the installation back plate assembly 2, and the nozzle head assembly of the patch head suction nozzle assembly 4 drives the suction nozzle to move up and down on the STAR axis, and the pneumatic valve island seat assembl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a patch pasting method and device for a patch head of a patch pasting machine. The patch pasting is carried by adopting a mode of combining a plurality of patch heads, in addition, all of the patch heads can be independently regulated, and the amplitude change operation of the path heads is realized through respectively regulating the positions of the patch heads; for the independent regulation among the patch heads, the vertical reciprocating pasting movement of the Z-axis patch heads, and the transverse amplitude change movement of each P-axis suction nozzle seat and the rotating regulating movement of STAR-axis patch suction nozzles of each patch head are respectively and independently completed. All of the patch heads are respectively arranged on a patch head installing seat, and the position regulation is respectively carried out through a patch head installing back plate assembly and a patch head suction nozzle assembly, so that the patch head can realize the amplitude change movement, and good effects are achieved for improving the performance of the integral patch pasting machine.

Description

technical field [0001] The invention belongs to a component operation method and device of electronic device manufacturing and processing equipment, especially a method and device for mounting a chip mounter head for small electronic devices, and is mainly used for high-speed and stable mounting on a PCB board. , Accurate placement of small electronic components. It realizes the fully automatic control from pcb board feeding, board feeding, positioning, placement head suction, positioning, and placement. Background technique [0002] The placement machine is also called "mounting machine" and "Surface Mount System". A device that is placed on a PCB pad. Divided into manual and fully automatic two. The automatic placement machine is a device used to realize high-speed and high-precision automatic placement of components. It is the most critical and complex equipment in the entire SMT production. The placement machine is the main equipment in the SMT production line. The p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
CPCH05K3/301
Inventor 高自成李立君龙新元朱更明罗记能肖军信
Owner CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap