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Solder paste

A solder paste and flux technology, used in welding equipment, welding media, welding/cutting media/materials, etc., can solve problems such as poor stability and achieve the effect of maintaining meltability

Inactive Publication Date: 2015-02-11
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the solder paste described in the above-mentioned conventional patent document 3 has poor stability over time due to the unoptimized flux components, and the solder paste thickens in a shorter time than solder powder with a larger particle size. Sticky, become unsuitable paste and other bad situation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach ＞

[0024] Solder paste is made by mixing flux containing solvent, rosin, thixotropic agent and activator with solder powder. Such as figure 1 As shown, the solder powder 10 has a central core 13, a first cladding layer 11 composed of an intermetallic compound of copper and tin covering a part of the central core 13, and a cladding core 13 and the first cladding layer. The composite powder of the second cladding layer 12 made of tin on the entire exposed surface of 11. And the central core 13 is a single structure comprised of the intermetallic compound of silver and tin in this embodiment. Here, as the intermetallic compound of copper and tin constituting the first cladding layer 11, Cu 3 Sn or Cu 6 sn 5 , as the intermetallic compound of silver and tin constituting the central core 13, Ag 3 Sn or Ag 4 Sn.

[0025] It is preferable that the average particle diameter of the said solder powder is 0.1-5 micrometers. Furthermore, the content of tin in the solder powder is pre...

no. 2 Embodiment approach ＞

[0052] image 3 The second embodiment of the present invention is shown. image 3 neutralize figure 1 The same symbols denote the same components. In this embodiment, the central core 33 of the solder powder 30 has a double structure in which the entire silver 33a is covered with an inner core coating layer 33b made of an intermetallic compound of silver and tin. That is, the solder powder 30 has a central core 33 having a double structure, a first cladding layer 11 composed of an intermetallic compound of copper and tin covering a part of the central core 33, and a coating layer 11 covering the central core 33 and the first cladding layer. Composite powder of the second coating layer 12 made of tin on the entire exposed surface of the coating layer 11 . Here, Ag 3 Sn or Ag 4 Sn. Except for the above, the configuration is the same as that of the solder powder of the first embodiment. Furthermore, the solder paste has the same configuration as the solder paste of the fir...

Embodiment

[0057] Next, examples of the present invention will be described in detail together with comparative examples.

[0058]

[0059] Such as figure 1 As shown, first, a solder powder 10 (core-shell structure) having an average particle diameter of 0.1 μm is produced, which is a central core 13 having a single structure composed of an intermetallic compound of silver and tin, and a part of the central core 13 is covered. Composite powder of a first cladding layer 11 composed of an intermetallic compound of copper and tin, and a second cladding layer 12 composed of tin covering the central core 13 and the entire exposed surface of the first cladding layer 11 , and contain silver, copper, and tin in proportions of 3.0% by mass, 0.5% by mass, and 96.5% by mass, respectively. Next, 44.5% by mass of diethylene glycol monohexyl ether (solvent), 47.1% by mass of polymerized rosin (rosin), 3.0% by mass of hardened castor oil (thixotropic agent), and 0.4% by mass of diethylamine hydrobro...

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Abstract

This solder paste can be produced by mixing a flux which comprises a solvent, a rosin, a thixotropic agent and an activator with a solder powder which has a mean particle diameter of 0.1 to 5mum. The solder powder is composed of composite particles, each of which comprises: a core; a first covering layer which consists of a copper-tin intermetallic compound and which covers at least a part of the core; and a second covering layer which consists of tin and which covers all the exposed surfaces of the core and the first covering layer. The core has a single structure which consists of a silver-tin intermetallic compound. The activator contains, relative to 100 mass% of the flux, 0.3 to 0.6 mass% of a hydrohalic acid amine salt and 0.1 to 10 mass% of a compound other than hydrohalic acid amine salts, said compound being an amine, an organohalogen compound, an organic acid, an organic acid ammonium salt, an organic acid amine salt or the like.

Description

technical field [0001] The present invention relates to a solder paste for forming solder bumps on a substrate used for mounting electronic components on the substrate. In addition, this international application claims based on Japanese Patent Application No. 171151 (Patent Application No. 2012-171151) filed on August 1, 2012 and Japanese Patent Application No. 149615 (Patent Application No. 2013-149615) filed on July 18, 2013. Right of priority, all contents of patent application 2012-171151 and patent application 2013-149615 are used in this international application. Background technique [0002] Conventionally, there has been disclosed a flux for soldering paste containing a dicarboxylic acid having 3 to 5 carbon atoms and a dicarboxylic acid having 15 to 20 carbon atoms as an activator of the flux for soldering paste (Patent Document 1). [0003] The flux for solder paste constituted in this way prevents skinning (a state in which the surface of the solder paste hard...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/14B23K35/363B22F9/24B23K35/26B23K35/30B23K35/40C22C5/06C22C9/02C22C13/00B22F1/107B22F1/17
CPCB23K35/0244B23K35/362C22C9/02B23K35/3006B22F1/0074B23K35/3601B23K35/365B23K35/40C22C13/00B23K35/025B23K35/26B23K35/3618B23K35/30B23K35/22B22F1/025C22C5/06B23K35/302B22F1/107B22F1/17
Inventor 植杉隆二宇野浩规
Owner MITSUBISHI MATERIALS CORP
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