Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board and green-oil hole sealing process

A printed circuit and oil-sealed hole technology, which is applied in printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problem that the product is difficult to fully meet the customer's quality and appearance requirements, the sealing hole is easy to leak oil to other positions, and it is difficult to control the sealing Hole depth and other issues, to achieve the effect of not easy to deform, large amount of oil, and meet the requirements of sealing depth and quality

Active Publication Date: 2015-03-04
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the PCB industry, the relatively simple screen method is generally used to seal the holes directly. However, this method has the disadvantages of easy deformation of the screen, insufficient alignment accuracy, and oil leakage to other positions when sealing the holes; in addition, this method Difficult to control sealing depth
The products made by this method have gradually been difficult to fully meet the requirements of customers in terms of quality and appearance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board and green-oil hole sealing process
  • Printed circuit board and green-oil hole sealing process
  • Printed circuit board and green-oil hole sealing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The present application will be further elaborated below by way of examples.

[0026] In this embodiment, a green oil sealing process for a printed circuit board comprises the following steps:

[0027] The production of the sealing bottom plate: the thickness of the sealing bottom plate is 1.0mm, the cutting size of the sealing bottom plate is 3 inches larger than each side of the sealing plate, and the hole is drilled in the area corresponding to the sealing position of the sealing plate, and the hole diameter is 3.0mm;

[0028] The area on the sealing base plate corresponding to the sealing position of the sealing plate is drilled, and the hole diameter is larger than the hole diameter of the sealing position, so that the air in the hole can be removed in time when the hole is sealed, and the formation of air bubbles in the hole will not affect the circuit board. Electrical performance.

[0029] Production of the sealing mesh (made of aluminum sheet): the thickness ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a printed circuit board and a green-oil hole sealing process. The green-oil hole sealing process comprises the following steps: manufacturing of a hole sealing base plate, manufacturing of a hole sealing net, fore treatment, hole sealing and solidification. According to the invention, the hole sealing net (rigid net, the material can be aluminum sheets, stainless steel sheets and the like) is employed to replace a conventional silk net, and compared to the silk net, the oil screening amount is large, the hole sealing quality is good and full, and the process is suitable for plates of various types. Besides, the hole sealing base plate is also cushioned below a hole sealing plate, and boring is carried out on an area, which is opposite to the hole sealing position of the hole sealing plate, on the hole sealing base plate, such that air in a hole during hole sealing can be timely exhausted, and the electrical performance of the circuit board is prevented from being affected due to a bubble formed in the hole. Through manufacture of the hole sealing base plate and the hole sealing net, coupled with proper technical parameters, the requirements of a client for hole sealing depth and quality can be well satisfied.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and a green oil sealing process. Background technique [0002] Printed circuit boards are the basic electronic components in the electronics industry, and are used in many fields such as automobiles, home appliances, computers, communications, industry, medical and military. In printed circuit boards, some vias that are very close to the pad or densely routed vias often require plugging to prevent short circuits. In addition, if the vias at the bottom of the BGA (Ball Grid Array) are not test points, they need to be plugged to prevent short circuits and hidden tin beads. [0003] At present, in the PCB industry, the relatively simple screen method is generally used to seal the holes directly. However, this method has the disadvantages of easy deformation of the screen, insufficient alignment accuracy, and oil leakage to other positions when...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22H05K1/02
CPCH05K1/11H05K3/245H05K2201/09563H05K2203/025H05K2203/0789
Inventor 戴匡
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com