Printed circuit board and green-oil hole sealing process

Abstract

The invention discloses a printed circuit board and a green-oil hole sealing process. The green-oil hole sealing process comprises the following steps: manufacturing of a hole sealing base plate, manufacturing of a hole sealing net, fore treatment, hole sealing and solidification. According to the invention, the hole sealing net (rigid net, the material can be aluminum sheets, stainless steel sheets and the like) is employed to replace a conventional silk net, and compared to the silk net, the oil screening amount is large, the hole sealing quality is good and full, and the process is suitable for plates of various types. Besides, the hole sealing base plate is also cushioned below a hole sealing plate, and boring is carried out on an area, which is opposite to the hole sealing position of the hole sealing plate, on the hole sealing base plate, such that air in a hole during hole sealing can be timely exhausted, and the electrical performance of the circuit board is prevented from being affected due to a bubble formed in the hole. Through manufacture of the hole sealing base plate and the hole sealing net, coupled with proper technical parameters, the requirements of a client for hole sealing depth and quality can be well satisfied.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and a green oil sealing process. Background technique [0002] Printed circuit boards are the basic electronic components in the electronics industry, and are used in many fields such as automobiles, home appliances, computers, communications, industry, medical and military. In printed circuit boards, some vias that are very close to the pad or densely routed vias often require plugging to prevent short circuits. In addition, if the vias at the bottom of the BGA (Ball Grid Array) are not test points, they need to be plugged to prevent short circuits and hidden tin beads. [0003] At present, in the PCB industry, the relatively simple screen method is generally used to seal the holes directly. However, this method has the disadvantages of easy deformation of the screen, insufficient alignment accuracy, and oil leakage to other positions when...

AI Technical Summary

Problems solved by technology

[0003] At present, in the PCB industry, the relatively simple screen method is generally used to seal the holes directly. However, this method has the disadvantages of easy deformation of the screen, insufficient alignment accuracy, and oil leakage to other positions when sealing the holes; in addition, this method Difficult to control sealing depth

The products made by this method have gradually been difficult to fully meet the requirements of customers in terms of quality and appearance

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