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Substrate broken line restoration method and apparatus

A repair method and substrate technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as damage to the quality of TFT substrates

Active Publication Date: 2015-03-11
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the above two methods are high-temperature reactions, which will damage the quality of the TFT substrate

Method used

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  • Substrate broken line restoration method and apparatus
  • Substrate broken line restoration method and apparatus
  • Substrate broken line restoration method and apparatus

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Embodiment Construction

[0027] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0028] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no interveni...

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Abstract

The invention discloses a substrate broken line restoration method and apparatus. The substrate broken line restoration method comprises the following steps: mixing a reducing agent with a silver-ammonia solution to obtain a mixed solution A; and coating the mixed solution A at the broken line position of a substrate to finish broken line restoration of the substrate. The substrate broken line restoration method, on the basis of silver mirror reaction, generates a silver membrane at the broken line position of the substrate to finish restoration of a broken line. Since the silver-ammonia solution and the reducing agent can react with each other at a normal temperature to generate the silver membrane, and laser or heating is unnecessary, a TFT substrate is prevented from being damaged duo to too high temperature in a restoration process, and the quality of the TFT substrate is ensured. The apparatus implementing the substrate broken line restoration method is simple in structure and easy to operate.

Description

technical field [0001] The invention relates to the field of thin film transistors, in particular to a substrate disconnection repair method and device. Background technique [0002] During the production of TFT (Thin Flim Transistor, thin film transistor) substrates, the fabrication of the metal film layer is after photolithography, therefore, the formed pattern may have broken lines. In order to avoid quality problems, it is necessary to repair the broken wires. [0003] Generally, laser beams are used to achieve chemical vapor deposition of thin films. The specific method is to form a repair line at the disconnection defect of the substrate wire, and then heat the repair line to complete the repair of the disconnection. Essentially, there are two mechanisms for chemical reactions triggered by laser light: one is photochemical reactions; the other is thermal-induced chemical reactions. The former uses high-energy photons to decompose molecules into films, while the latte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/02035H01L21/67138H01L2221/67
Inventor 张祥
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD