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Split type data flow controllable observable high-speed serial receiving device

A high-speed serial and receiving device technology, applied in the direction of electrical digital data processing, instruments, etc., can solve poor configurability and observability, can not solve the limitations of high-speed serial receiving module, elastic buffer module bit width and limited depth and other issues to achieve the effects of simplifying sequential logic design, improving configurability and observability, and good configurability

Inactive Publication Date: 2015-03-18
苏州中科集成电路设计中心有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a design has the following limitations: Since the elastic buffer module is on-chip of the high-speed serial receiving module, its configurability and observability are poor; and the bit width and depth of the on-chip elastic buffer module are limited, This limits the size of the largest TLP packet that the receiving module can receive (TLP packets cannot be truncated by other information); in this structure, there are three clock domains on the chip: data recovery clock, local crystal oscillator clock, and system clock PCLK
This patent does not solve the limitations of the existing high-speed serial receiver modules pointed out above

Method used

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  • Split type data flow controllable observable high-speed serial receiving device
  • Split type data flow controllable observable high-speed serial receiving device
  • Split type data flow controllable observable high-speed serial receiving device

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Embodiment Construction

[0023] like figure 2 The split-type data flow shown can control the observable high-speed serial receiving device, which includes a device body 1, and a differential signal input port 2 is arranged on the device body 1. The special feature is that the differential signal input port 2 adopted in the present invention The port 2 is provided with an ASIC receiving component 3, and the communication port of the ASIC receiving device is connected with an off-chip buffer component 4, and the off-chip buffer component 4 is provided with an input clock signal port and a parallel output signal port.

[0024] As far as a preferred embodiment of the present invention is concerned, the ASIC receiving component 3 includes a differential receiving module 5 in consideration of effective processing of serial communication. Specifically, the input end of the differential receiving module 5 is connected to the differential signal input port 2 , and the output end of the differential receiving ...

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Abstract

The invention relates to a split type data flow controllable observable high-speed serial receiving device. The split type data flow controllable observable high-speed serial receiving device comprises a device body, wherein a differential signal input port is arranged on the device body. The split type data flow controllable observable high-speed serial receiving device is characterized in that an ASIC receiving assembly is arranged on the differential signal input port; a communication port of the ASIC receiving device is connected with an off-chip buffering assembly; accordingly an integral SerDes receiving circuit can be achieved by adopting ASCI and an on-chip structure does not comprise an on-chip buffering module, clock driving mainly depends on data recovery, and the clock domain is simplified and a sequential logic design is simplified due to the fact that the number of clocks is reduced by one. Additionally, the off-chip elastic buffering module is achieved through FPGA and accordingly the configurability and the observability of the off-chip elastic buffering module are greatly improved.

Description

technical field [0001] The invention relates to a serial receiving device, in particular to a split-type data stream controllable and observable high-speed serial receiving device. Background technique [0002] High-speed (data rate above GHz) serial communication, such as backplane-to-backplane and chip-to-chip communication, requires the support of SerDes transceiver modules. Under the existing technical conditions, the transceiver modules above GHz can only be realized with ASIC chips. Existing commercial SerDes chips and reusable IP are similar to a black box, and it is difficult to control and observe the data flow inside it. When designing the high-speed IO protocol stack, the effective transmission rate of the channel can be improved by optimizing the TLP (Transaction Layer Packet) packet length and the clock compensation sequence transmission frequency. This requires a device to control and observe the internal data flow of the SerDes receiving module in real time....

Claims

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Application Information

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IPC IPC(8): G06F13/40
CPCG06F13/4018
Inventor 刘晓飞顾正明刘新宇严天鸣
Owner 苏州中科集成电路设计中心有限公司
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