Spin treatment apparatus

A technology for processing devices and rotating bodies, which is applied to devices, optics, instruments, etc. that apply liquid to the surface, can solve the problems of deviation of the position of the substrate from the predetermined position, uneven rotation of the clamping pin, etc., so as to suppress the deviation of the position of the substrate. Effect

Inactive Publication Date: 2015-03-25
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if there is a variation in the distance between the magnetic poles, the rotation of each holding pin tends to become uneven, and since the positioning of the substrate is performed based on the one with the shortest distance between the magnetic poles among the plurality of holding pins, there is When the position of the substrate during clamping deviates from the predetermined position due to the deviation of the rotation

Method used

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no. 1 Embodiment approach

[0021] refer to Figure 1 to Figure 8 The first embodiment will be described.

[0022] Such as figure 1 As shown, the spin processing device 1 according to the first embodiment includes a base body 2 serving as a base, a cup body 3 with an open upper surface, a rotating body 4 rotating inside the cup body 3 , and a device for rotating the rotating body 4 . A drive motor 5, an annular liquid receiving unit 6 surrounding the rotating body 4, and a control unit (for example, a microcomputer, etc.) 7 for controlling each unit.

[0023] The base body 2 is formed in a plate shape, and a through-hole 2 a is formed at the center of the bottom surface of the base body 2 . In addition, a plurality of discharge pipes (not shown) for discharging waste liquid are connected at predetermined intervals to the peripheral portion of the base body 2 .

[0024] The cup body 3 is formed in a cylindrical shape (annular shape) with an open upper surface and a lower surface, and accommodates the r...

no. 2 Embodiment approach

[0072] refer to Figure 9 and Figure 10 The second embodiment will be described.

[0073] The second embodiment is basically the same as the first embodiment. Therefore, in the second embodiment, differences from the first embodiment (the structure of the rotating magnet 31 b ) will be described, and the same parts as those described in the first embodiment will be denoted by the same reference numerals, and description thereof will be omitted.

[0074] Such as Figure 9 As shown, in the spin processing device 1 according to the second embodiment, the rotation magnets 31b are provided at the front ends of the upper and lower arms 31c, and the rotation magnets 32b are respectively provided at the front ends of the upper and lower arms 32c. Since these rotation magnets 31b and 32b have the same structure, description of the rotation magnet 32b will be omitted. In addition, each of the upper and lower arms 31c and 32c does not have the through-hole 33 of the first embodiment...

no. 3 Embodiment approach

[0081] refer to Figure 11 The third embodiment will be described.

[0082] The third embodiment is basically the same as the first embodiment. Therefore, in the third embodiment, the difference from the first embodiment (the arm moving mechanism) will be described, and the same parts as those described in the first embodiment will be assigned the same reference numerals, and their description will be omitted.

[0083] Such as Figure 11 As shown, the spin processing device 1 of the third embodiment is configured so that the upper and lower arms (moving the upper and lower arms 101) of one or two clamping pins (clamping pins) 21 of the upper and lower arms 31c or 32c and the other A mechanism that moves the upper and lower arms independently up and down in parallel (arm movement mechanism). The movable upper and lower arms 101 are pressed by a spring 103 so as to be independently movable in parallel along the sliding shaft 102 fixed to the upper and lower rings 32d. Furthe...

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Abstract

A spin treatment apparatus according to an embodiment can suppress generation of dust and displacement of a substrate when clamped, performs a treatment while rotating a substrate and includes: at least three clamp pins configured to contact an outer peripheral surface of the substrate and clamp the substrate; rotatable pin rotators provided for the respective clamp pins and each configured to retain the corresponding clamp pin at a position offset from a rotation axis of the pin rotator parallel with a rotation axis of the substrate; magnet gears provided for the respective pin rotators around outer peripheral surfaces thereof and each having a magnetic-pole part formed spirally about the rotation axis of the pin rotator; rotation magnets provided for the respective magnet gears and positioned to attract and be attracted by the magnetic-pole part of the corresponding magnet gear; and a movement mechanism configured to move the rotation magnets along the rotation axes of the pin rotators.

Description

technical field [0001] Embodiments of the present invention relate to a spin processing device. Background technique [0002] Generally, in the manufacturing process of a semiconductor device and a liquid crystal display device, there are a film formation process and a photo process (photo process) for forming a circuit pattern on a substrate such as a wafer or a glass plate. Among these processes, mainly in a wet process using a liquid, a spin processing apparatus is used to perform chemical liquid processing, cleaning processing, drying processing, and the like on a substrate. The spin processing device grasps (clamps) the outer peripheral surface of the substrate, rotates the substrate with the axis perpendicular to the center of the substrate as the rotation axis, and supplies the processing liquid (such as chemical solution and pure water, etc.) to the rotating substrate. Apparatus for wet processing. The spin processing apparatus generally includes a clamping mechani...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304B05C13/00
CPCG03F7/162G03F7/3021G03F7/42H01L21/68728H01L21/67011B05C9/08B05C11/08B05C13/00
Inventor 古矢正明
Owner SHIBAURA MECHATRONICS CORP
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