A pressing and fixing component for packaging transistors

A technology for fixing components and transistors, which is used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, and electrical solid-state devices. Production management costs, great process complexity, and the effect of reducing the size of the whole machine
CN104465419BActive Publication Date: 2017-09-05GOODWE TECHNOLOGIES CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
GOODWE TECHNOLOGIES CO LTD
Publication Date
2017-09-05

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Abstract

The invention relates to a pressing and fixing assembly used for packaging transistors. The pressing and fixing assembly comprises a PCBA board, the transistors, metal elastic pieces and plastic fixing parts, wherein the metal elastic pieces and the plastic fixing parts are combined together. A containing cavity is formed by the side wall and the bottom wall in each plastic fixing part, inner buckles and supporting ribs are arranged on the inner side wall and / or the inner bottom wall of each containing cavity, the metal elastic pieces are inserted between the inner buckles and the supporting ribs to be fixed on the plastic fixing parts, a supporting step is arranged on the inner side wall and / or the inner bottom wall of each containing cavity, and outer buckles are arranged on the outer bottom wall of each containing cavity and extend outwards in the reverse direction of the corresponding metal elastic piece. By the adoption of the technical scheme, the size of the PCBA board is greatly reduced, the size of a complete machine is reduced, the material cost of the complete machine is reduced obviously, the heat dissipation stability and the reliability are high, the pressing and fixing assembly is low in cost, the technological complexity of the welding process can be greatly lowered, the technological time is shortened, the defect rate in the process is decreased, and the production management cost is reduced.
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Description

technical field

[0001] The invention belongs to the technical field of switching power supplies and photovoltaic inverters, and is applied to the T0247 packaging used in current AC-DC conversion or similarly packaged transistors for heat dissipation, pressing and fixing, and specifically relates to a pressing and fixing assembly for packaging transistors. Background technique

[0002] At present, in the field of photovoltaic inverters, there are mainly the following methods for the assembly, heat dissipation, compression and fixing of transistors and PCBA boards:

[0003] 1. PCBA opening, transistor mounting, wave soldering, such as figure 1 As shown, for this structure, the machine welding of the transistor 5 has certain advantages in consistency, quality and cost, but it is necessary to increase the intermediate transition heat sink 3, so that the heat conduction resistance increases, and the heat dissipation performance of the transistor 5 decreases. In addition, the PCBA...

Claims

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