A pressing and fixing component for packaging transistors
A technology for fixing components and transistors, which is used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, and electrical solid-state devices. Production management costs, great process complexity, and the effect of reducing the size of the whole machine
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[0039] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.
[0040] refer to figure 1As shown, a pressing and fixing assembly for packaging transistors includes a PCBA board 2 and a transistor 5. The pressing and fixing assembly includes a combined metal spring 7 and a plastic fixing part 8, and the plastic fixing part 8 is composed of a side wall Form a cavity with the bottom wall, the inner wall of the cavity and / or the inner bottom wall are provided with an inner buckle 9 and a support rib 10, and the metal shrapnel 7 is fixed on the plastic fixing part by being inserted between the inner buckle 9 and the support rib 10 8, a supporting step 11 is provided on the inner wall and / or inner bottom wall of the cavity, and an outer buckle 12 extending outward is provided on the outer bottom wall of the cavity, which is perpendicular to the outer bottom wall of the cavity.
[0041] It also include...
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